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Data Sheet
Home > Data Sheet > 0033
0033

0033

Model 0033
Description FET INPUT HIGH SPEED VOLTAGE FOLLOWER/BUFFER AMPLIFIER
PDF file Total 6 pages (File size: 453K)
Chip Manufacturer ETC
APPLICATION NOTES
HEAT SINKING
To determine if a heat sink is necessary for your application
and if so, what type, refer to the thermal model and governing
equation below.
R
θSA
= ((T
J
- T
A
)/P
D
) - (R
θJC
) - (R
θCS
)
= ((125°C - 80°C) / .64W) - 65°C/W - .15°C/W
= 70.3 - 65.15
= 5.2°C/W
The heat sink in this example must have a thermal resistance
of no more than 5.2°C/W to maintain a junction temperature of
no more than +125°C.
Thermal Model:
OFFSET VOLTAGE ADJUST
See Figure 1. To externally null the offset voltage, connect a
200Ω potentiometer between Pins 7 and 10 and leave Pin 6
open. If offset null is not necessary, short Pin 6 to Pin 7 and
remove the 200Ω potentiometer. Do not connect Pin 7 to -
Vcc.
Governing Equation:
T
J
=P
D
x (R
θJC
+ R
θCS
+ R
θSA
) + T
A
Where
T
J
= Junction Temperature
P
D
= Total Power Dissipation
R
θJC
= Junction to Case Thermal Resistance
R
θCS
= Case to Heat Sink Thermal Resistance
R
θSA
= Heat Sink to Ambient Thermal Resistance
T
C
= Case Temperature
T
A
= Ambient Temperature
T
S
= Sink Temperature
Example:
This example demonstrates a worst case analysis for the buffer
output stage. This occurs when the output voltage is 1/2 the
power supply voltage. Under this condition, maximum power
transfer occurs and the output is under maximum stress.
Conditions:
V
CC
= ±16VDC
V
O
= ±8Vp Sine Wave, Freq. = 1KHz
R
L
= 100Ω
For a worst case analysis we will treat the ±8Vp sine wave
as an 8 VDC output voltage.
1.) Find Driver Power Dissipation
P
D
= (V
CC
-V
O
) (V
O
/R
L
)
= (16V-8V) (8V/100Ω)
= 640mW
2.) For conservative design, set T
J
=+125°C Max.
3.) For this example, worst case T
A
=+80°C
4.) R
θJC
= 65°C/W from MSK 0033B Data Sheet
5.) R
θCS
= 0.15°C/W for most thermal greases
6.) Rearrange governing equation to solve for R
θSA
CURRENT LIMITING
See Figure 1. If no current limit is required, short Pin 1 to Pin
12 and Pin 9 to Pin 10 and delete Q1 thru Q4 connections. Q1
through Q4 and the Rlim resistors form a current source current
limit scheme and current limit resistor values can be calculated
as follows:
+Rlim
Vbe
-Rlim
Vbe
Isc
Isc
Since current limit is directly proportional to the base-emitter
voltage drop of the 2N2222's and 2N2907's in the current
limit scheme, the current limit value will change slightly with
ambient temperature changes. The base-emitter voltage drop
will decrease as temperature increases causing the actual cur-
rent limit point to decrease.
POWER SUPPLY BYPASSING
Both the negative and the positive power supplies must be
effectively decoupled with a high and low frequency bypass
circuit to avoid power supply induced oscillation. An effective
decoupling scheme consists of a 0.1 microfarad ceramic ca-
pacitor in parallel with a 4.7 microfarad tantalum capacitor from
each power supply pin to ground.
3
Rev. B 7/00
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