0034.5619.21
| Model | 0034.5619.21 |
| Description | Electric Fuse, Time Lag Blow, 1.6A, 250VAC, 35A (IR), Surface Mount, ROHS COMPLIANT |
| PDF file | Total 3 pages (File size: 396K) |
| Chip Manufacturer | SCHURTER |
Non resettable fuses
SMD-FST
Surface Mount Fuse, 5 x 20 mm, Time-Lag T, L, 250 VAC, Au plating
IEC 60127-2 · 250 VAC · Time-Lag T
Description
- Directly solderable on printed circuit boards
- L = Low Breaking Capacity
- For rated current 1 A to 16 A, SMD-SPT is recommended
Applications
References
- Primary Protection on SMD PCB
Time-Current Curves see last page
Standards
- IEC 60127-2/3
- UL 248-14
- CSA C22.2 no. 248.14
Weblinks
Approvals
- VDE License Number: 40011522
- UL File Number: E41599
Technical Data
Rated Voltage
Rated Current
Breaking Capacity
Characteristic
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
250 VAC
0.05 - 20 A
35 A - 125 A
Time-Lag T
PCB,SMT
-55 °C to 125 °C
55/125/21 acc. to IEC 60068-1
Glass
Gold-Plated Copper Alloy
1.05 g
0 °C to 60 °C, max. 70% r.h.
, Current Rating, Voltage Rating, Cha-
racteristic, Breaking Capacity
Soldering Methods
Solderability
Resistance to Soldering Heat
Resistance to Vibration
Load Humidity Test
Moisture Resistance Test
Terminal Strength
Thermal Shock
Reflow
245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
260 °C / 10 sec acc. to IEC 60068-2-58,
Test Td
acc. to IEC 60068-2-6, test Fc
MIL-STD-202, Method 103B
(1000h @ 0.1*In @ 0.85 r.H. @ 85°C)
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
(Deflection of board 1 mm for 1 minute)
MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to
+125°C)
acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
MIL-STD-202, Method 215A
Case Resistance
Resistance to Solvents
Dimensions
Length
20 mm
10
±0.2
+0.1
-0.2
ø 5.2
5
5.5
20
±0.5
Solder pads
9.5
5.5
Fuses
