11DF2
| Model | 11DF2 |
| Description | FRD LOW FORWARD VOLTAGE DROP |
| PDF file | Total 5 pages (File size: 89K) |
| Chip Manufacturer | NIEC |
FRD
Type
:
11DF2
FEATURES
* Miniature Size
* Ultra - Fast Recovery
* Low Forward Voltage drop
* Low Power Loss, High Efficiency
* High Surge Capability
* 200 Volts thru 400 Volts Types Available
* 52mm Inside Tape Spacing Package Available
OUTLINE DRAWING
Maximum Ratings
Rating
Repetitive Peak Reverse Voltage
Non-repetitive Peak Reverse Voltage
Average Rectified Output Current
RMS Forward Current
Surge Forward Current
Operating JunctionTemperature Range
Storage Temperature Range
Symbol
V
RRM
V
RSM
I
O
I
F(RMS)
I
FSM
Tjw
Tstg
30
1.0
Approx Net Weight:0.33g
11DF2
200
220
50Hz Half Sine
Ta=27°C
∗1
Wave Resistive Load
Ta=63°C
∗2
1.57
50Hz Half Sine Wave,1cycle,
Non-repetitive
- 40 to + 150
- 40 to + 150
Unit
V
V
A
A
A
°C
°C
Electrical
•
Thermal Characteristics
Characteristics
Peak Reverse Current
Peak Forward Voltage
Reverse Recovery Time
Symbol
I
RM
V
FM
trr
Conditions
Min. Typ. Max.
-
-
-
-
-
-
-
-
10
0.98
30
115
81
Unit
µA
V
ns
°C/W
Tj= 25°C, V
RM
= V
RRM
Tj= 25°C, I
FM
= 1.0A
-di/dt=50A/µs, I
FM
=1A, Ta=25
Junction to
∗1
: Without Fin
Thermal Resistance
Rth(j-a)
Ambient
∗2
: P.C. Board mounted
∗1
: Without Fin or P.C. Board
∗2
: P.C. Board mounted(L=8mm,Print Lands =10x10mm,Both Sides)
