11EFS4
| Model | 11EFS4 |
| Description | FRD |
| PDF file | Total 5 pages (File size: 39K) |
| Chip Manufacturer | NIEC |
FRD
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Type :
1 1 E FS4
OUTLINE DRAWING
FEATURES
Miniature Size
Ultra-Fast Recovery
Low Forward Voltage Drop
Low Power Loss, High Efficiency
High Surge Capability
200 Volts through 400 Volts Types Available
26mm and 52mm Inside Tape Spacing
Maximum Ratings
Rating
Repetitive Peak Reverse Voltage
Non-repetitive Peak Reverse Voltage
Average Rectified
Output Current
RMS Forward Current
Surge Forward Current
Operating JunctionTemperature
Range
Storage Temperature Range
Symbol
V
RRM
V
RSM
I
O
I
F(RMS)
I
FSM
Tjw
Tstg
0.8
1
30
Approx Net Weight:0.17g
11EFS4
400
440
Ta=30°C
Without Fin
∗1
50Hz Half Sine
Ta=24°C
P.C.B.Mounted
∗2
WaveResistive Load
Unit
V
V
A
A
A
°C
°C
1.57
50Hz Half Sine Wave,1cycle,Non-repetitive
- 40 to + 150
- 40 to + 150
Electrical
•
Thermal Characteristics
Characteristics
Peak Reverse Current
Peak Forward Voltage
Reverse Recovery
Time
Thermal Resistance
Symbol
I
RM
V
FM
trr
Conditions
Tj= 25°C, V
RM
= V
RRM
Tj= 25°C, I
FM
= 1 A
I
FM
= 1 A, -di/dt= 50 A/µs, Ta= 25°C
Without Fin,PCB
∗
1
P.C.Board Mounted
∗
2
Min Typ
-
-
-
-
-
-
-
-
Max
20
1.25
30
140
110
Unit
µA
V
ns
°C/W
Rth(j-a) Junction to Ambient
∗1
Without Fin or P.C.Board
∗2
P.C. Board Mounted(L=3mm, Print Lands = 5x5 mm,Both Sides)
