1A225
| Model | 1A225 |
| Description | High-Performance LED(Single-Mode Datacom) |
| PDF file | Total 10 pages (File size: 192K) |
| Chip Manufacturer | MITEL |
PRODUCT INFORMATION
880
nm
1A225
High-Performance LED
Single-Mode Datacom
Compared with lasers and ELEDs,
this device can reduce device costs in
single-mode Ethernet networks. And
since it’s packaged in a hermeti-cally
sealed can, it achieves high reliability
even in harsh operating environ-
ments.
Optical and Electrical Characteristics
PARAMETER
SYMBOL
MIN.
TYP
.
MAX.
UNIT
(25°C Case Temperature)
TEST CONDITION
Fiber-Coupled Power
(Fig. 1, 2,& 3) (Table 1)
P
fiber
t
r,tf
f
c
p
2.0
2.5
7
50
10
W
ns
MHz
900
nm
nm
2.2
20
V
A
pF
I
F
=50 mA
(Note 1)
Fiber:
10/125 m
Single
Mode
NA=0.11
Rise and Fall Time
(10-90%)
I
F
=50 mA
(no bias)
Bandwidth
(3 dBel )
I
F
=50 mA
I
F
=50 mA
I
F
=50 mA
I
F
=50 mA
V
R
=1V
Peak Wavelength
Spectral Width
(FWHM)
Forward Voltage
(Fig.5)
Reverse Current
Capacitance
860
880
50
V
F
I
R
C
2.0
250
V
R
= 0V, f=1 MHz
Note 1:
Measured at the exit of 100 meters of fiber.
Absolute Maximum Ratings
Ø4.7
Ø1.5
0.6
PARAMETER
SYMBOL
LIMIT
Storage Temperature
Operating Temperature
(derating: Fig.4)
Electrical Power Dissipation
(derating: Fig.4)
T
stg
Top
P
tot
I
F
I
FRM
V
R
T
sld
-55 to +125 C
-55 to +125 C
130 mW
60 mA
100 mA
1.5 V
260 C
3.7
14
Continuous Forward Current
(f
0.4
10 kHz)
50%, f 1 MHz)
Peak Forward Current
(duty cycle
Reverse Voltage
All dimensions in mm
CASE
CATHODE
ANODE
Soldering Temperature
(2mm from the case for 10 sec)
2.5
5.4
BOTTOM VIEW
The diode chip is isolated from the case.
Thermal Characteristics
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
TO-46 Package With Lens
Thermal Resistance - Infinite Heat Sink
Thermal Resistance - No Heat Sink
R
thjc
-0.4
0.3
300
600
C/W
C/W
%/ C
nm/ C
R
thja
Temperature Coefficient - Optical Power
dP/dT
j
Temperature Coefficient -W
avelength
d /dT
j
11905.11 1998-02-04
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Tel
(46) 8 58 02 45 00
Fax
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(44) 1291 436180
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