24-CERDIP
| Model | 24-CERDIP |
| Description | 24-Pin Ceramic Dual In-Line Package (CerDIP) |
| PDF file | Total 1 pages (File size: 27K) |
| Chip Manufacturer | ALTERA |
Altera Device Package Information
24-Pin Ceramic Dual In-Line Package (CerDIP)
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All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Description
Ordering Code Reference
Package Acronym
Lead Material
Lead Finish
JEDEC Outline
JEDEC Option
Weight
Moisture Sensitivity Level
D
CerDIP
Alloy 42
Solder dip (60/40 typical)
MS-030
AF
4.1 g
Printed on moisture barrier bag
Package Outline Figure Reference
Specification
Symbol
Min.
A
A1
A2
b
b2
E2
e
L
θ
D
E
E1
E3
N
0.125
0°
1.240
0.290
0.280
0.325
–
0.015
0.140
0.015
0.049
0.365
Inches
Nom.
–
0.028
–
0.018
0.057
0.380
0.100 BSC
–
–
1.260
0.305
0.295
–
24
–
15°
1.280
0.320
0.310
0.410
Max.
0.200
0.041
0.175
0.021
0.065
0.395
Maximum Lead Coplanarity N/A
Package Outline
B
E
1
E1
0.005 Min
E3
E
0.090 Max
D
Base Plane
C
0
E2
Seating Plane
b2
b
A
A1
L
e
NÐ2 Places
A2
A
24
Altera Corporation
Copyright © 2002 Altera Corp.
