90151-3204
| Model | 90151-3204 |
| Description | Board Connector, 4 Contact(s), 2 Row(s), Female, Straight, Solder Terminal |
| PDF file | Total 1 pages (File size: 119K) |
| Chip Manufacturer | MOLEX |
2.54mm (.100") Pitch
C-Grid III
™
PC Board Connectors
C
2.54mm (.100") Pitch PCB and Wire Connectors
90151
Dual Row, Vertical
Features and Benefits
■
Sizes 4 to 64 circuits
■
Contact and plating orientation according to
DIN 41651
■
Stackable in 2 directions
■
Meets HE 13/14 specification
Reference Information
Product Specification: PS-99020-0001
Packaging: Tube
Mates With: 0.64mm (.025") square pins
Use With: 1.57mm (.062") thick PC boards
Designed In: Inches
Electrical
Voltage: 350V
Current: 3.0A
Contact Resistance: 20 milliohms max.
Insulation Resistance: 1000 Megohms min.
Mechanical
Contact Retention to Housing: 15N min.
Mating Force: 1N max. Gold and 3N max. Tin
Unmating Force: 0.2N min. Gold and 0.2N min. Tin
Normal Force: 1N
Physical
Housing: Black glass-filled polyester, UL 94V-O
Contact: Copper Alloy
Plating: See Table
Operating Temperature: -55 to +125˚C
Recommended Mating Pin Length:
5.65mm (.222") min. to 7.00mm (.275") max.
Not For Use With Molex SL
™
Components
Order No.
Circuits
4
6
8
10
14
16
20
26
34
40
50
60
64
Plating A
Straight Tail
Plating E
Plating F
Plating A
Plating A: 1.00mm (39m") min. Hot Tin dip
Plating E: 0.38mm (15m") selective Gold over Nickel and 4mm (160m") Tin over Nickel
Plating F: 0.76mm (30m") selective Gold over Nickel and 4mm (160m") Tin over Nickel
Kinked Tail
Plating E
Plating F
Lead-free
Yes
For other available circuit sizes contact Molex
2.54mm (.100") Pitch
C-Grid III
™
PC Board Connectors
90152
Dual Row, Horizontal
Features and Benefits
■
Sizes 4 to 64 circuits
■
Contact and plating orientation according to
DIN 41651
■
Stackable end-to-end
■
Meets HE 13/14 specification
Reference Information
Product Specification: PS-99020-0001
Packaging: Tube
Mates With: 0.64mm (.025") square pins
Use With: 1.57mm (.062") thick PC boards
Designed In: Inches
Electrical
Voltage: 350V
Current: 3.0A
Contact Resistance: 20 milliohms max.
Insulation Resistance: 1000 Megohms min.
Mechanical
Contact Retention to Housing: 8.8N min.
Mating Force: 1N max. Gold and 3N max. Tin
Unmating Force: 0.2N min. Gold and 0.2N min. Tin
Normal Force: 1N
Physical
Housing: Black glass-filled polyester, UL 94V-O
Contact: Copper Alloy
Plating: See Table
Operating Temperature: -55 to +125˚C
Recommended Mating Pin Length:
5.65mm (.222") min. to 7.00mm (.275") max.
Not For Use With Molex SL
™
Components
Order No.
Circuits
4
6
8
10
14
16
20
Plating A
Straight Tail
Plating E
Plating F
Lead-free
Circuits
26
34
40
50
60
64
Plating A: 1.00mm (39m") min. Hot Tin dip
Plating E: 0.38mm (15m") selective Gold over Nickel and 4mm (160m") Tin over Nickel
Plating F: 0.76mm (30m") selective Gold over Nickel and 4mm (160m") Tin over Nickel
Order No.
Straight Tail
Plating A
Plating E
Plating F
Lead-free
Yes
Yes
For other available circuit sizes contact Molex
C-50 MX07
