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B1S-T3

B1S-T3

Model B1S-T3
Description 0.5A MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
PDF file Total 3 pages (File size: 59K)
Chip Manufacturer WTE
W TE
PO WE R SEM IC O ND UC TO R S
B1S – B8S
0.5A MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Features
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Glass Passivated Die Construction
Low Forward Voltage Drop
High Current Capability
High Surge Current Capability
Designed for Surface Mount Application
Plastic Material – UL Recognition Flammability
Classification 94V-O
G
B
-
~
+
~
H
D
C
E
M
A
L
Mechanical Data
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Case: Molded Plastic
Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
Polarity: As Marked on Case
Weight: 0.22 grams (approx.)
Mounting Position: Any
Marking: Type Number
J
K
MB-S
Dim
Min
Max
A
4.50
4.90
B
3.80
4.20
C
0.006
0.35
D
0.20
E
7.0
G
0.70
1.10
H
1.30
1.70
J
2.30
2.70
K
2.30
2.70
L
3.00
M
0.50
0.80
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
@T
A
=25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@T
A
= 40°C
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
B1S
B2S
B4S
B6S
B8S
Unit
100
70
200
140
400
280
0.5
600
420
800
560
V
V
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I
2
t Rating for Fusing (t < 8.35ms)
Forward Voltage per element
Peak Reverse Current
At Rated DC Blocking Voltage
@I
F
= 0.5A
@T
A
= 25°C
@T
A
= 125°C
I
FSM
I
2
t
V
FM
I
RM
C
j
R
JA
T
j
, T
STG
30
10
1.0
5.0
500
25
85
-55 to +150
A
A
2
s
V
µA
pF
K/W
°C
Typical Junction Capacitance (per leg) (Note 1)
Typical Thermal Resistance (per leg) (Note 2)
Operating and Storage Temperature Range
Note: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
2. Thermal resistance junction to ambient mounted on PC board with 13mm
2
copper pads.
B1S – B8S
1 of 3
© 2002 Won-Top Electronics
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