B32521-C3224-K
| Model | B32521-C3224-K |
| Description | CAPACITOR, METALLIZED FILM, POLYESTER, 250V, 0.22uF, THROUGH HOLE MOUNT, RADIAL LEADED, LEAD FREE |
| PDF file | Total 45 pages (File size: 772K) |
| Chip Manufacturer | EPCOS |
B32520 ... B32529
General purpose (stacked/wound)
Mounting guidelines
1
1.1
Soldering
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155
°C).
Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
1.2
235
±5 °C
2.0
±0.5
s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder
≥90%,
free-flowing solder
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series
Solder bath temperature Soldering time
10
±1
s
MKT boxed (except 2.5
×
6.5
×
7.2 mm) 260
±5 °C
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5
×
6.5
×
7.2 mm)
MKP (lead spacing
≤
7.5 mm)
MKT uncoated (lead spacing
≤
10 mm)
insulated (B32559)
5
±1
s
<4s
recommended soldering
profile for MKT uncoated
(lead spacing
≤
10 mm) and
insulated (B32559)
Please read
Important notes
at the end of this document.
Page 37 of 45
