C0402C224K7PAC7867
| Model | C0402C224K7PAC7867 |
| Description | Capacitor, Ceramic, Chip, General Purpose, 0.22uF, 4.0V, ±10%, X5R, 0402 (1005 mm), -55º ~ +85ºC, 13" Reel |
| PDF file | Total 18 pages (File size: 890K) |
| Chip Manufacturer | KEMET |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
01005
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
Metric
Size
Code
0402
0603
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
Density Level A:
Maximum (Most)
Land Protrusion (mm)
C
0.33
0.38
0.50
0.90
1.00
1.60
1.60
2.30
2.15
2.15
2.75
2.70
Y
0.46
0.56
0.72
1.15
1.35
1.35
1.35
1.75
1.60
1.60
1.70
1.70
X
0.43
0.52
0.72
1.10
1.55
1.90
2.80
2.30
3.60
6.90
5.50
6.90
V1
1.60
1.80
2.20
4.00
4.40
5.60
5.65
7.40
6.90
6.90
8.20
8.10
V2
0.90
1.00
1.20
2.10
2.60
2.90
3.80
3.30
4.60
7.90
6.50
7.90
C
0.28
0.33
0.45
0.80
0.90
1.50
1.50
2.20
2.05
2.05
2.65
2.60
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Y
0.36
0.46
0.62
0.95
1.15
1.15
1.15
1.55
1.40
1.40
1.50
1.50
X
0.33
0.42
0.62
1.00
1.45
1.80
2.70
2.20
3.50
6.80
5.40
6.80
V1
1.30
1.50
1.90
3.10
3.50
4.70
4.70
6.50
6.00
6.00
7.30
7.20
V2
0.70
0.80
1.00
1.50
2.00
2.30
3.20
2.70
4.00
7.30
5.90
7.30
C
0.23
0.28
0.40
0.60
0.75
1.40
1.40
2.10
1.95
1.95
2.55
2.50
Density Level C:
Minimum (Least)
Land Protrusion (mm)
Y
0.26
0.36
0.52
0.75
0.95
0.95
0.95
1.35
1.20
1.20
1.30
1.30
X
0.23
0.32
0.52
0.90
1.35
1.70
2.60
2.10
3.40
6.70
5.30
6.70
V1
1.00
1.20
1.60
2.40
2.80
4.00
4.00
5.80
5.30
5.30
6.60
6.50
V2
0.50
0.60
0.80
1.20
1.70
2.00
2.90
2.40
3.70
7.00
5.60
7.00
Density Level A:
For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B:
For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C:
For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Soldering Profile:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1006_X5R_SMD • 5/7/2012
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