C0402C470F8GAC
| Model | C0402C470F8GAC |
| Description | Ceramic Capacitor, Multilayer, Ceramic, 10V, 1% +Tol, 1% -Tol, C0G, -/+30ppm/Cel TC, 0.000047uF, 0402, |
| PDF file | Total 19 pages (File size: 1011K) |
| Chip Manufacturer | KEMET |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T
2
P
2
ØDo
Po
[10 pitches cumulative
tolerance on tape ±0.2 mm]
E
1
Ao
F
Ko
B
1
Bo
E
2
W
S
1
T
1
Cover Tape
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
Center Lines of Cavity
P
1
ØD
1
Embossment
For cavity size,
see Note 1 Table 5
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8mm
12mm
16mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
D
0
D
1
Min.
Note 1
1.0
(0.039)
1.5
(0.059)
E
1
P
0
P
2
R Ref.
Note 2
25.0
(0.984)
30
(1.181)
S
1
Min.
Note 3
0.600
(0.024)
T Max.
T
1
Max.
1.75 ± 0.10
(0.069 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
8mm
12mm
16mm
Pitch
Single (4mm)
Single (4mm) &
Double (8mm)
Triple (12mm)
B
1
Max.
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E
2
Min.
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
3.5 ± 0.05
(0.138 ± 0.002)
5.5 ± 0.05
(0.217 ± 0.002)
5.5 ± 0.05
(0.217 ± 0.002)
P
1
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
T
2
Max
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W Max
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A
0
,B
0
& K
0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S
1
<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A
0
, B
0
and K
0
shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4).
(e) for KPS Series product A
0
and B
0
are measured on a plane 0.3mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1003_C0G • 8/10/2011
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