C0402T621J8RALTM
| Model | C0402T621J8RALTM |
| Description | Ceramic Capacitor, Multilayer, Ceramic, 10V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.00062uF, Surface Mount, 0402, CHIP |
| PDF file | Total 21 pages (File size: 1M) |
| Chip Manufacturer | KEMET |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
0402
0603
0805
1206
1210
1210
1
1812
2220
1
Metric
Size
Code
1005
1608
2012
3216
3225
3225
4532
5650
Density Level A:
Maximum (Most)
Land Protrusion (mm)
C
0.50
0.90
1.00
1.60
1.60
1.50
2.15
2.75
Y
0.72
1.15
1.35
1.35
1.35
1.60
1.60
1.70
X
0.72
1.10
1.55
1.90
2.80
2.90
3.60
5.50
V1
2.20
4.00
4.40
5.60
5.65
5.60
6.90
8.20
V2
1.20
2.10
2.60
2.90
3.80
3.90
4.60
6.50
C
0.45
0.80
0.90
1.50
1.50
1.40
2.05
2.65
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Y
0.62
0.95
1.15
1.15
1.15
1.40
1.40
1.50
X
0.62
1.00
1.45
1.80
2.70
2.80
3.50
5.40
V1
1.90
3.10
3.50
4.70
4.70
4.70
6.00
7.30
V2
1.00
1.50
2.00
2.30
3.20
3.30
4.00
5.90
C
0.40
0.60
0.75
1.40
1.40
1.30
1.95
2.55
Density Level C:
Minimum (Least)
Land Protrusion (mm)
Y
0.52
0.75
0.95
0.95
0.95
1.20
1.20
1.30
X
0.52
0.90
1.35
1.70
2.60
2.70
3.40
5.30
V1
1.60
2.40
2.80
4.00
4.00
4.00
5.30
6.60
V2
0.80
1.20
1.70
2.00
2.90
3.00
3.70
5.60
Only for capacitance values ≥ 22 µF
Density Level A:
For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B:
For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C:
For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805, and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Soldering Profile:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1027_X7R_COTS_SMD • 1/9/2013
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