ES52C1B20N-19.000MTR
| Model | ES52C1B20N-19.000MTR |
| Description | TCXO, CLIPPED SINE OUTPUT, 19 MHz, ROHS COMPLIANT, CERAMIC, SMD, 10 PIN |
| PDF file | Total 2 pages (File size: 155K) |
| Chip Manufacturer | ECLIPTEK |
PART NUMBERING GUIDE
ES52C1 C 25 V - 13.000M TR
OPERATING TEMPERATURE RANGE
A=0°C to 50°C
B=0°C to 70°C
C=-20°C to 70°C
D=-30°C to 85°C
E=-40°C to 85°C
FREQUENCY STABILITY
10 = ±1.0ppm Maximum
15 = ±1.5ppm Maximum
20 = ±2.0ppm Maximum
25 = ±2.5ppm Maximum
PACKAGING OPTIONS
Blank=Bulk
TR=Tape and Reel
FREQUENCY
EXTERNAL TRIM
N=None (No Connection on Pin 1)
V=Voltage Control
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
Pin 1: Control Voltage
or No Connect
Pin 5: Case Ground
Pin 6: Output
Pin 10: Supply Voltage
Pin 2-4, 7-9: No Connection
Tolerances= +0.1
TAPE
A
16.0±0.2
B
7.5±0.1
C
6.75±0.1
D
4.0±0.1
E
2.0±0.1
F
REEL
M
1.5 MIN
N
50 MIN
O
U
360 MAX
P
V
16.4+2-0
Q
40 MIN
QTY/REEL
1,000
20.2 MIN 13.0±0.2
F
8.0±0.1
G
H
J
A0*
K
0.30 ±0.05
L
K0*
R
2.5 MIN
S
10 MIN
T
22.4 MAX
B0* 1.5 +0.1-0.0
*Compliant to EIA 481A
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
Characteristic
Fine Leak Test
Gross Leak Test
Mechanical Shock
Vibration
Solderability
Temperature Cycling
Resistance to Soldering Heat
Resistance to Solvents
Specification
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-883, Method 2007, Condition A
MIL-STD-883, Method 2002
MIL-STD-883, Method 1010
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MARKING SPECIFICATIONS
Line 1: E XX.XXX
Frequency in MHz (5 Digits Maximum + Decimal)
Line 2: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV
.
DATE
ECLIPTEK CORP.
OSCILLATOR
ES52C1
CERAMIC
3.3V
OS4K
03/06
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
