GT28F320C3BC100
| Model | GT28F320C3BC100 |
| Description | Flash, 2MX16, 100ns, PBGA48, CSP, MICRO, BGA-48 |
| PDF file | Total 70 pages (File size: 903K) |
| Chip Manufacturer | NUMONYX |
3 Volt Advanced+ Boot Block Flash
Memory
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Preliminary Datasheet
Product Features
s
s
s
s
s
s
Flexible SmartVoltage Technology
— 2.7 V–3.6 V Read/Program/Erase
— 12 V for Fast Production Programming
High Performance
— 2.7 V–3.6 V: 70 ns Max Access Time
Optimized Architecture for Code Plus Data
Storage
— Eight 4-Kword Blocks, Top or Bottom
Locations
— Up to One Hundred-Twenty-Seven 32-
Kword Blocks
— Fast Program Suspend Capability
— Fast Erase Suspend Capability
Flexible Block Locking
— Lock/Unlock Any Block
— Full Protection on Power-Up
— WP# Pin for Hardware Block Protection
— V
PP
= GND Option
— V
CC
Lockout Voltage
Low Power Consumption
— 9 mA Typical Read Power
— 7 µA Typical Standby Power with
Automatic Power Savings Feature
Extended Temperature Operation
— –40 °C to +85 °C
s
s
s
s
s
s
s
s
Improved 12 V Production Programming
— Faster Production Programming
— No Additional System Logic
128-bit Protection Register
— 64-bit Unique Device Identifier
— 64-bit User Programmable OTP Cells
Extended Cycling Capability
— Minimum 100,000 Block Erase Cycles
Supports Flash Data Integrator Software
— Flash Memory Manager
— System Interrupt Manager
— Supports Parameter Storage, Streaming
Data (e.g., voice)
Automated Word/Byte Program and Block
Erase
— Command User Interface
— Status Registers
Cross-Compatible Command Support
— Intel Basic Command Set
— Common Flash Interface
x16 I/O for Various Applications
— 48-Ball
µBGA*
Package
— 48-Ball VF BGA Package
— 64-Ball Easy BGA Package
— 48-Lead TSOP Package
0.18
µ
ETOX™ VII Flash Technology
The 3 Volt Advanced+ Boot Block Flash memory, manufactured on Intel’s latest 0.18 µ
technology, represents a feature-rich solution for low power applications. 3 Volt Advanced+
Boot Block Flash memory devices incorporate low voltage capability (2.7 V read, program and
erase) with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution.
Intel® 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 48-ball
µBGA*, 48-ball Very Thin Profile Fine Pitch BGA (VF BGA), and 64-ball Easy BGA
packages. Additional information on this product family can be obtained by accessing the Intel
®
Flash website: http://www.intel.com/design/flash.
Notice:
This document contains preliminary information on new products in production. The
specifications are subject to change without notice. Verify with your local Intel sales office that
you have the latest datasheet before finalizing a design.
Order Number: 290645-009
April 2000
