HFC03SM-4N7C-RC
| Model | HFC03SM-4N7C-RC |
| Description | General Purpose Inductor, |
| PDF file | Total 1 pages (File size: 396K) |
| Chip Manufacturer | ALLIED |
RoHS
HFC03SM
0.039±0.004
(1.0±0.10)
High Frequency Chip Inductors
0.0197±0.004
(0.5±0.10)
Dimensions:
Inches
(mm)
0.0197±0.004
(0.50±0.10)
0.010±0.004
(0.25±0.10)
0.016
(0.40)
0.197
(0.50)
Features
• 0402 EIA size for high board density
• Excellent Q and SRF characteristics
for high frequency applications.
•
Cost effective monolithic construction
0.512
(1.3)
0.0177
(0.45)
Allied
Part
Number
Inductance
Tolerance
(nh)
(%)
@100MHz,200mV
Q
Min
SRF
(MHz)Min
DCR
Max.
(Ω)
IDC
Max.
(mA)
HFC03SM-1N5J-RC
HFC03SM-1N6J-RC
HFC03SM-1N8J-RC
HFC03SM-2N0J-RC
HFC03SM-2N2J-RC
HFC03SM-2N4J-RC
HFC03SM-2N7J-RC
HFC03SM-3N0J-RC
HFC03SM-3N3J-RC
HFC03SM-3N6J-RC
HFC03SM-3N9J-RC
HFC03SM-4N3J-RC
HFC03SM-4N7J-RC
HFC03SM-5N1J-RC
HFC03SM-5N6J-RC
HFC03SM-6N2J-RC
HFC03SM-6N8J-RC
HFC03SM-7N5J-RC
HFC03SM-8N2J-RC
HFC03SM-9N1J-RC
HFC03SM-10NJ-RC
HFC03SM-12NJ-RC
HFC03SM-15NS-RC
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
12
15
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
5300
4300
4200
3900
3600
3400
3200
2800
2300
0.10
0.10
0.10
0.12
0.15
0.15
0.15
0.15
0.15
0.15
0.19
0.20
0.20
0.20
0.20
0.25
0.25
0.25
0.30
0.34
0.35
0.35
0.46
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
300
300
300
300
300
Electrical
Inductance range:
1.5nh to 15nh
Tolerance:
Available in: J=5%, S=+/-0.3nH,
C=+/-.2nH
Test Frequency:
Inductance and Q
tested at 100MHz, 200mv with HP4291A
Impedance Analyzer
Inductance vs Freq. Characteristics
measured on HP4291A
Q vs Frequency Characteristics
measured on HP4291A
SRF measured on HPE4991 & HP87530
DCR measured on Chen Hwa CH502BC
or HP4338B
Mechanical
Operating Temperature:
-55ºC ~ 125ºC
Storage Temperature:
-55ºC ~125ºC
(after PCB) Humidty 40% - 70% (before)
Solderability:
95% terminal coverage
Test Condition:
Pre heat:150ºC. 1min.
Solder composition:
Sn/Ag3.0/Cu.0.5 (Pb free)
Solder temp: 245ºC±5ºC (pb Free)
Immersion time: 1=4± 1 sec.
Resistance to solder heat:
No damage to part
Test Condition
Pre heat: 150ºC. 1min.
Solder composition:
Sn/Ag3.0/Cu.0.5 (Pb free)
Solder temp: 260ºC±5ºC (pb Free)
Immersion time: 10 ± 1 sec.
Physical
Packaging:
10000 pieces per
7 inch
reel.
Additional Inductance values available upon request.
All specifications subject to change without notice
.
949-356-1780
ALLIED COMPONENTS INTERNATIONAL
08/29/2014
www.alliedcomponents.com
