I17120XYI01
| Model | I17120XYI01 |
| Description | Speech Synthesizer With RCDG, 240s, DIE |
| PDF file | Total 24 pages (File size: 351K) |
| Chip Manufacturer | WINBOND |
ISD1700 SERIES
11.3 28-L
EAD
600-M
IL
P
LASTIC
D
UAL
I
NLINE
P
ACKAGE
(PDIP)
Plastic Dual Inline Package (PDIP) (P) Dimensions
INCHES
Min
1.445
0.065
0.600
0.530
0.015
0.125
0.015
0.055
0.008
0.070
0°
Nom
1.450
0.150
0.070
0.540
Max
1.455
0.075
0.625
0.550
0.19
0.135
0.022
0.065
0.012
0.080
15°
Min
36.70
1.65
15.24
13.46
0.38
3.18
0.38
1.40
0.20
1.78
0°
MILLIMETERS
Nom
36.83
3.81
1.78
13.72
Max
36.96
1.91
15.88
13.97
4.83
3.43
0.56
1.65
0.30
2.03
15°
A
B1
B2
C1
C2
D
D1
E
F
G
H
J
S
0
0.018
0.060
0.100
0.010
0.075
0.46
1.52
2.54
0.25
1.91
11.4 D
IE
I
NFORMATION
For die info, please contact the local Winbond Sales Representatives.
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Publication Release Date: January 23, 2007
Revision 1.3-S2
