I17210XY
| Model | I17210XY |
| Description | Speech Synthesizer With RCDG, 420s, DIE |
| PDF file | Total 24 pages (File size: 351K) |
| Chip Manufacturer | WINBOND |
ISD1700 SERIES
10 TYPICAL APPLICATION CIRCUITS
The following typical applications examples on ISD1700 Series are for references only. They make no
representation or warranty that such applications shall be suitable for the use specified. Each design
has to be optimized in its own system for the best performance on voice quality, current consumption,
functionalities and etc.
The below notes apply to the following applications examples:
*
**
These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirements, they can be 10
μF,
4.7
μF
or other values.
Please refer to the applications notes or consult Winbond for layout advice.
It is important to have a separate path for each ground and power back to the related terminals to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible
.
Example #1: Recording using microphone input via push-button controls
24
23
25
26
19
22
REC
PLAY
ERASE
FWD
VOL
FT
3
Reset
0.1
μ
F
vAlert
**
V
CCA
V
CCD
V
CCP
V
CCA
0.1
μ
F
V
CCP
*
0.1
μ
F
*
*
RESET
LED
2
V
CCD
1
V
SSD
28
V
CCA
21
V
SSA
8
1 KΩ
D1
V
CCD
0.1
μ
F
*
Vcc
Gnd
**
V
CC
4.7 K
Ω
4.7
μ
F
4.7 K
Ω
7
6
5
4
SS
SCLK
MOSI
MISO
MIC+
MIC -
AnaIn
R
OSC
AGC
ISD1700
V
CCP
14
V
SSP1
16 0.1
μ
F
V
SSP2
12
SP+
SP-
15
13
10
0.1
μ
F
0.1
μ
F
4.7 KΩ
Rosc ***
9
20
18
4.7
μ
F
*** At 8kHz sampling freq, Rosc = 80 K
11
Speaker
or Buzzer
V
CC
Speaker
AUD/AUX
17
AUD
V
CCD
100 K
Ω
Optional
8050C
390
Ω
AUX
INT/RDY
27
0.1
μ
F
Optional: based upon the applications
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
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