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I1821B-08TT

I1821B-08TT

Model I1821B-08TT
Description Low Power Mobile VGA EMI Reduction IC
PDF file Total 8 pages (File size: 61K)
Chip Manufacturer ALSC
P1818/19/20/21/22
®
Mechanical Package Outline (8-Pin SOIC)
Inches
Symbol
C
Millimeters
Max
0.071
0.010
0.069
0.020
0.01
0.202
0.164
Min
1.45
0.10
1.35
0.31
0.10
4.72
3.75
Nor
1.63
0.18
1.55
0.41
0.15
4.92
3.95
1.27 BSC
5.70
0.30
6.00
0.50
6.30
0.70
Max
1.80
0.25
1.75
0.51
0.25
5.12
4.15
Min
L
Nor
0.064
0.007
0.061
0.016
0.006
0.194
0.156
A
A1
0.057
0.004
0.053
0.012
0.004
0.186
0.148
P18xxx
LOT NUMBER
YYWW
H
E
A2
B
C
a
D
E
e
D
0.050 BSC
0.224
0.012
0.236
0.020
0.248
0.028
A2
A
H
L
B
e
A1
a
Note: Controlling dimensions are millimeters.
SOIC: 0.074 grams unit weight.
Mechanical Package Outline (8-Pin TSSOP)
Inches
Symbol
C
Millimeters
Max
0.047
0.006
0.041
0.012
0.008
0.122
0.177
Min
0.05
0.80
0.19
0.09
2.90
4.30
Nor
1.00
3.00
4.40
0.65 BSC
6.20
0.45
6.40
0.60
6.60
0.75
Max
1.10
0.15
1.05
0.30
0.20
3.10
4.50
Min
L
Nor
0.039
0.118
0.173
A
A1
0.002
0.031
0.007
0.004
0.114
0.169
Lot #
YYWW
P
18xxx
H
E
A2
B
C
a
D
E
D
A2
A
e
H
0.026 BSC
0.244
0.018
0.252
0.024
0.260
0.030
B
e
A1
L
a
Note: Controlling dimensions are millimeters.
TSSOP: 0.034 grams unit weight.
March 2003
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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