I1822C-08TT
Model | I1822C-08TT |
Description | Low Power Mobile VGA EMI Reduction IC |
PDF file | Total 8 pages (File size: 61K) |
Chip Manufacturer | ALSC |
P1818/19/20/21/22
®
Mechanical Package Outline (8-Pin SOIC)
Inches
Symbol
C
Millimeters
Max
0.071
0.010
0.069
0.020
0.01
0.202
0.164
Min
1.45
0.10
1.35
0.31
0.10
4.72
3.75
Nor
1.63
0.18
1.55
0.41
0.15
4.92
3.95
1.27 BSC
5.70
0.30
0°
6.00
0.50
5°
6.30
0.70
8°
Max
1.80
0.25
1.75
0.51
0.25
5.12
4.15
Min
L
Nor
0.064
0.007
0.061
0.016
0.006
0.194
0.156
A
A1
0.057
0.004
0.053
0.012
0.004
0.186
0.148
P18xxx
LOT NUMBER
YYWW
H
E
A2
B
C
a
D
E
e
D
0.050 BSC
0.224
0.012
0°
0.236
0.020
5°
0.248
0.028
8°
A2
A
H
L
B
e
A1
a
Note: Controlling dimensions are millimeters.
SOIC: 0.074 grams unit weight.
Mechanical Package Outline (8-Pin TSSOP)
Inches
Symbol
C
Millimeters
Max
0.047
0.006
0.041
0.012
0.008
0.122
0.177
Min
–
0.05
0.80
0.19
0.09
2.90
4.30
Nor
–
–
1.00
–
–
3.00
4.40
0.65 BSC
6.20
0.45
0°
6.40
0.60
–
6.60
0.75
8°
Max
1.10
0.15
1.05
0.30
0.20
3.10
4.50
Min
L
Nor
–
–
0.039
–
–
0.118
0.173
A
A1
–
0.002
0.031
0.007
0.004
0.114
0.169
Lot #
YYWW
P
18xxx
H
E
A2
B
C
a
D
E
D
A2
A
e
H
0.026 BSC
0.244
0.018
0°
0.252
0.024
–
0.260
0.030
8°
B
e
A1
L
a
Note: Controlling dimensions are millimeters.
TSSOP: 0.034 grams unit weight.
March 2003
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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