J3669
| Model | J3669 |
| Description | Mini size of Discrete semiconductor elements |
| PDF file | Total 15 pages (File size: 501K) |
| Chip Manufacturer | ETC |
Axial Devices (Through-Hole)
A
B
A
C
D
A
Dim
A-405
DO-35
DO-41
Plastic
DO-41
Glass
DO-15
DO-201
DO-201AD
R-6
T-1
5W
5KP
5KW
Min
25.40
25.40
25.40
25.40
25.40
25.40
25.40
25.40
25.40
25.40
25.40
25.40
Max
Min
4.10
4.06
5.50
8.50
7.20
8.60
2.60
8.38
B
Max
5.20
4.00
5.21
4.70
7.62
9.53
9.50
9.10
3.20
8.89
8.60
9.00
Min
0.53
0.71
0.686
0.96
1.20
1.20
0.53
0.94
0.95
1.20
C
Max
0.64
0.60
0.864
0.863
0.889
1.06
1.30
1.30
0.64
1.09
1.07
1.30
Min
2.00
2.00
2.60
4.80
4.80
8.60
2.20
3.30
D
Max
2.70
2.00
2.72
2.71
3.60
5.21
5.30
9.10
2.60
3.68
9.53
8.00
TO-92
WOG / AM
A
E
A
B
Dim
A
B
Min
4.32
4.32
12.50
0.36
3.15
2.29
1.14
Max
4.83
4.78
15.62
0.56
3.94
2.79
1.40
B
+
-
Dim
A
D
Min
8.84
4.00
27.90
25.40
0.71
4.60
Max
9.86
4.60
0.81
5.60
C
C
D
E
G
H
C
E
B
C
D
E
D
BOTTOM
VIEW
-
G
+
G
G
H
G
H
Lead configuration shown is for bulk product packaging only.
See ANSI/EIA-486 for Radial Tape specifications.
SOP-8 / TSSOP-8
E
Dim
A
A1
D
E
H
L
e1
e2
Mi ll im et er s
SOP-8 / TSSOP-8
Min.
Max .
1. 35
/ 1 . 0
1. 75
/ 1 . 2
0. 10
/ 0.1
4. 80
/ 2 . 9
3. 80
/ 4 . 3
0. 25
/ 0.15
5. 00
/ 3 . 1
4. 00
/ 4 . 5
H
e1
D
e2
5. 80
/ 6 . 2
6. 20
/ 6 . 6
0. 40
/ -
1. 27
/ -
0. 33
/ -
0. 51/
-
1. 27B S C
/ 0.65BSC
A1
A
0.004max.
P.31
