JAN1N3821AUR-1TR
| Model | JAN1N3821AUR-1TR |
| Description | SILICON 1 WATT ZENER DIODES |
| PDF file | Total 3 pages (File size: 275K) |
| Chip Manufacturer | MICROSEMI |
1N3821 thru 1N3830A
1 Watt Metal Case Zener Diodes
SCOTTSDALE DIVISION
DESCRIPTION
This well established zener diode series for the 1N3821 thru 1N3830A
JEDEC registration in the glass hermetic sealed DO-13 package provides a
low voltage selection for 3.3 to 7.5 volts. It is also well suited for high-
reliability applications where it is available in JAN, JANTX, and JANTXV
military qualifications. Higher voltages are also available in the 1N3016
thru 1N3051 series (6.8 V to 200 V) in the same package (see separate
data sheet). Microsemi also offers numerous other Zener diode products
for a variety of other packages including surface mount.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-13
(DO-202AA)
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
FEATURES
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Zener Voltage Range: 3.3 V to 7.5 V
Hermetically sealed DO-13 metal package
Internally solder-bonded construction.
Also available in JAN, JANTX, JANTXV
qualifications per MIL-PRF19500/115 by adding the
JAN, JANTX, or JANTXV prefixes to part numbers
for desired level of screening, e.g. JANTX1N3821,
JANTXV1N3051A, etc.
Surface mount also available with 1N3821UR-1
thru 1N30330AUR-1 series on separate data sheet
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APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Low voltage selection from 3.3 to 7.5 V
Tight voltage tolerances available
Low reverse (leakage) currents
Nonsensitive to ESD
Hermetically sealed metal package
Inherently radiation hard as described in Microsemi
MicroNote 050
•
MAXIMUM RATINGS
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Operating Junction and Storage Temperatures:
-65
o
C to +175
o
C
•
THERMAL RESISTANCE: 50
o
C/W* junction to lead
at 0.375 inches (10 mm) from body or 110
o
C/W
junction to ambient when leads are mounted on FR4
PC board with 4 mm
2
copper pads (1 oz) and track
width 1 mm, length 25 mm
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DC Power Dissipation
*
: 1 Watt at T
L
< +125
o
C 3/8”
(10 mm) from body or 1.0 Watts at T
L
< +65
o
C when
mounted on FR4 PC board as described for thermal
resistance above (also see Fig 1)
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Forward Voltage @ 200 mA: 1.5 Volts.
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Solder Temperatures: 260
o
C for 10 s (maximum)
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MECHANICAL AND PACKAGING
CASE: DO-13 (DO-202AA), welded, hermetically
sealed metal and glass
FINISH: All external surfaces are Tin-Lead (Pb/Sn)
plated and solderable per MIL-STD-750 method
2026
POLARITY: Cathode connected case.
WEIGHT: 1.4 grams.
Tape & Reel option: Standard per EIA-296 (add
“TR” suffix to part number)
See package dimensions on last page
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1N3821 – 1N3830A
* For further mounting reference, thermal resistance from junction to metal case may be reduced to
<
20
o
C/W
when mounting DO-13 metal case directly on heat sink.
Copyright
2003
11-06-2003 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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