JANMLL4125-1
| Model | JANMLL4125-1 |
| Description | Zener Diode, 47V V(Z), 5%, 0.5W, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, SURFACE MOUNT PACKAGE-2 |
| PDF file | Total 3 pages (File size: 131K) |
| Chip Manufacturer | MICROSEMI |
SCOTTSDALE DIVISION
IN4099UR-1 thru 1N4135UR-1
(or MLL4099-1 thru MLL4135-1)
and
1N4614UR-1 thru 1N4627UR-1
(or MLL4614-1 thru MLL4627-1)
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 0.5 WATT ZENERS
WWW .
Microsemi
.C
OM
DESCRIPTION
The 1N4099UR-1 thru 1N4135UR-1 and 1N4614UR-1 thru 1N4627UR-1
series of 0.5 watt glass surface mount DO-213AA Zener voltage regulators
provides a selection from 1.8 to 100 volts in standard 5% tolerances as well
as tighter tolerances identified by different suffix letters on the part number.
These have an internal-metallurgical-bond option as identified with the “-1”
suffix. This type of internally bonded Zener package construction is also
available in JAN, JANTX, and JANTXV military qualifications. Microsemi
also offers numerous other Zener products to meet higher and lower power
applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
APPEARANCE
DO-213AA
FEATURES
•
Surface mount equivalent to JEDEC registered 1N4099
thru 1N4135 and 1N4614 thru 1N4627 series
•
Internal metallurgical bond with the “-1” suffix
•
Nonbonded types also available without the “-1” suffix
for both the axial and surface mount packages (see
separate data sheets)
•
DO-7 or DO-35 glass body axial-leaded Zener
equivalents also available per JEDEC registration with
part numbers 1N4099 thru 1N4135 and 1N4614 thru
1N4627 on separate data sheets
•
RoHS Compliant devices available by adding “e3” suffix
•
•
•
•
•
•
•
•
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and
temperature range
Extensive selection from 1.8 to 100 V
Standard voltage tolerances are plus/minus 5% with
no suffix
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Hermetically sealed surface mount package
Nonsensitive to ESD per MIL-STD-750 Method 1020
Minimal capacitance (see Figure 3)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
•
Operating and Storage temperature: -65
º
C to +175
º
C
º
•
Thermal Resistance: 100 C/W junction to end cap, or
º
250 C/W junction to ambient when mounted on FR4 PC
board (1 oz Cu) with recommended footprint (see last
page)
•
Steady-State Power: 0.5 watts at end cap temperature
o
º
T
EC
< 125 C or at ambient T
A
< 50 C when mounted on
FR4 PC board as described for thermal resistance
above (see Figure 2 for derating)
•
Forward voltage @200 mA: 1.1 volts
•
Solder Temperatures: 260
º
C for 10 s (max)
MECHANICAL AND PACKAGING
•
CASE: Hermetically sealed glass DO-213AA (SOD80
or MLL34) MELF style package
•
FINISH: End caps Tin-lead (Sn/Pb) or RoHS
Compliant annealed matte-Tin plating solderable per
MIL-STD-750, method 2026
•
POLARITY: Cathode indicated by band where diode
is to be operated with the banded end positive with
respect to the opposite end for Zener regulation
•
MARKING: cathode band only
•
TAPE & REEL option: Standard per EIA-481-1-A with
12 mm tape, 2000 per 7 inch reel or 5000 per 13 inch
reel (add “TR” suffix to part number)
•
WEIGHT: 0.04 grams
•
See package dimensions on last page
1N4099UR-1–1N4135UR-1
1N4614UR-1–1N4627UR-1,e3
Copyright
©
2006
3-30-06 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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