JANS1N5292UR-1
| Model | JANS1N5292UR-1 |
| Description | CURRENT REGULATOR DIODES |
| PDF file | Total 2 pages (File size: 41K) |
| Chip Manufacturer | MICROSEMI |
• 1N5283UR-1 THRU 1N5314UR-1 AVAILABLE IN
JAN
,
JANTX, JANTXV AND
JANS
PER MIL-PRF-19500/463
• CURRENT REGULATOR DIODES
• LEADLESS PACKAGE FOR SURFACE MOUNT
• METALLURGICALLY BONDED
1N5283UR-1 thru 1N5314UR-1
and
CDLL5283 thru CDLL5314
MAXIMUM RATINGS
Operating Temperature: -65°C to +175°C
Storage Temperature: -65°C to +175°C
DC Power Dissipation: 500mW @ +75°C @ TEC = +125°C
Power Derating: 10 mW / °C above TEC = +125°C
Peak Operating Voltage: 100 Volts
ELECTRICAL CHARACTERISTICS
@ 25°C, unless otherwise specified
CDI
TYPE
NUMBER
NOM
CDLL5283
CDLL5284
CDLL5285
CDLL5286
CDLL5287
CDLL5288
CDLL5289
CDLL5290
CDLL5291
CDLL5292
CDLL5293
CDLL5294
CDLL5295
CDLL5296
CDLL5297
CDLL5298
CDLL5299
CDLL5300
CDLL5301
CDLL5302
CDLL5303
CDLL5304
CDLL5305
CDLL5306
CDLL5307
CDLL5308
CDLL5309
CDLL5310
CDLL5311
CDLL5312
CDLL5313
CDLL5314
0.22
0.24
0.27
0.30
0.33
0.39
0.43
0.47
0.56
0.62
0.68
0.75
0.82
0.91
1.00
1.10
1.20
1.30
1.40
1.50
1.60
1.80
2.00
2.20
2.40
2.70
3.00
3.30
3.60
3.90
4.30
4.70
REGULATOR CURRENT
l p (mA) @ VS = 25V
MIN
0.198
0.216
0.243
0.270
0.297
0.351
0.387
0.423
0.504
0.558
0.612
0.675
0.738
0.819
0.900
0.990
1.08
1.17
1.26
1.35
1.44
1.62
1.80
1.98
2.16
2.43
2.70
2.97
3.24
3.51
3.87
4.23
MAX
0.242
0.264
0.297
0.330
0.363
0.429
0.473
0.517
0.616
0.682
0.748
0.825
0.902
1.001
1.100
1.210
1.32
1.43
1.54
1.65
1.76
1.98
2.20
2.42
2.64
2.97
3.30
3.63
3.96
4.29
4.73
5.17
MINIMUM
DYNAMIC
IMPEDANCE
@VS = 25V
ZS (M )
(Note 1)
25.0
19.0
14.0
9.0
6.6
4.10
3.30
2.70
1.90
1.55
1.35
1.15
1.00
0.880
0.800
0.700
0.640
0.580
0.540
0.510
0.475
0.420
0.395
0.370
0.345
0.320
0.300
0.280
0.265
0.255
0.245
0.235
MINIMUM
KNEE
IMPEDANCE
@VK = 6.0 V
ZK (M )
(Note 2)
2.75
2.35
1.95
1.60
1.35
1.00
0.870
0.750
0.560
0.470
0.400
0.335
0.290
0.240
0.205
0.180
0.155
0.135
0.115
0.105
0.092
0.074
0.061
0.052
0.044
0.035
0.029
0.024
0.020
0.017
0.014
0.012
MAXIMUM
LIMITING
VOLTAGE
@ lL = 0.8 lp (min)
VL (VOLTS)
1.00
1.00
1.00
1.00
1.00
1.05
1.05
1.05
1.10
1.13
1.15
1.20
1.25
1.29
1.35
1.40
1.45
1.50
1.55
1.60
1.65
1.75
1.85
1.95
2.00
2.15
2.25
2.35
2.50
2.60
2.75
2.90
MILLIMETERS
DIM MIN MAX
D
2.39
2.66
F
0.41
0.55
G
4.80
5.20
G1
4.11 REF.
S
0.03 MIN.
INCHES
MIN MAX
.094 .105
.016 .022
.189 .205
.159 REF.
.001 MIN.
FIGURE 1
DESIGN DATA
CASE:
DO-213AB, Hermetically sealed
glass case. (MELF, LL41)
LEAD FINISH:
Tin / Lead
THERMAL RESISTANCE: (R
OJEC):
50 °C/W maximum at L = 0 inch
THERMAL IMPEDANCE: (Z
OJX): 25
°C/W maximum
POLARITY:
Diode to be operated with
the banded (cathode) end negative.
MOUNTING SURFACE SELECTION:
The Axial Coefficient of Expansion
(COE) Of this Device is Approximately
+6PPM/°C. The COE of the Mounting
Surface System Should Be Selected To
Provide A Suitable Match With This
Device.
NOTE 1
NOTE 2
ZS is derived by superimposing A 90Hz RMS signal equal to 10% of VS on VS
ZK is derived by superimposing A 90Hz RMS signal equal to 10% of VK on VK
6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841
PHONE (978) 620-2600
FAX (978) 689-0803
WEBSITE: http://www.microsemi.com
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