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Home > Data Sheet > JANSF2N2906AUBC
JANSF2N2906AUBC

JANSF2N2906AUBC

Model JANSF2N2906AUBC
Description Transistor
PDF file Total 35 pages (File size: 798K)
Chip Manufacturer MICROSEMI
The documentation and process conversion measures
necessary to comply with this document shall be
completed by 16 May 2013.
INCH-POUND
MIL-PRF-19500/291U
16 February 2013
SUPERSEDING
MIL-PRF-19500/291T
23 September 2011
PERFORMANCE SPECIFICATION SHEET
* SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON, SWITCHING,
TYPES 2N2906A, 2N2906AL, 2N2907A, 2N2907AL, 2N2906AUA,
2N2907AUA, 2N2906AUB, 2N2906AUBC, 2N2907AUB, 2N2907AUBC,
2N2906AUBN, 2N2906AUBCN, 2N2907AUBN, AND 2N2907AUBCN, JAN,
JANTX, JANTXV, JANS, JANSM, JANSD, JANSP, JANSL, JANSR, JANSF,
JANSG, JANSH JANHC, JANKC, JANKCM, JANKCD,
JANKCP, JANKCL, JANKCR, JANKCF, JANKCG, AND JANKCH
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for PNP, silicon, switching transistors. Five
levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500 and two
levels of product assurance are provided for each unencapsulated device type. Radiation hardness assurance (RHA)
level designators “M”, “D”, “P“, “L” “R”, “F’, “G”, and “H” are appended to the device prefix to identify devices which
have passed RHA requirements.
* 1.2 Physical dimensions. See
(similar to a TO-18), figure 2, (surface mount case outlines UA, figure 3
UB (metal lid, as shield, connected to fourth pad), UBC (ceramic lid, braze-ring connected to fourth pad), UBN (3-pin,
isolated metal lid), and UBCN (3-pin, isolated ceramic lid) and figures 4, and 5 (JANHC and JANKC).
1.3 Maximum ratings. Unless otherwise specified T
A
= +25°C.
Types
I
C
mA dc
All devices
600
V
CBO
V dc
60
V
EBO
V dc
5
V
CEO
V dc
60
T
J
and T
STG
°C
-65 to +200
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Since contact
information can change, you may want to verify the currency of this address information using the ASSIST Online
database at
.
AMSC N/A
FSC 5961
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