K1S3216BCC-FI70T
| Model | K1S3216BCC-FI70T |
| Description | Application Specific SRAM, 2MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, FBGA-48 |
| PDF file | Total 10 pages (File size: 162K) |
| Chip Manufacturer | SAMSUNG |
K1S3216BCC
PACKAGE DIMENSION
48 BALL FINE PITCH BGA(0.75mm ball pitch)
Top View
Bottom View
B
B
6
A
#A1
B
C
D
C1
E
F
G
H
Detail A
A
E1
Y
Notes.
1. Bump counts: 48(8 row x 6 column)
2. Bump pitch : (x,y)=(0.75 x 0.75)(typ.)
3. All tolerence are
±0.050
unless
specified beside figures.
4. Typ : Typical
5. Y is coplanarity
- 10 -
C
5
4
B1
UtRAM
Unit: millimeters
3
2
1
Side View
D
C
Min
A
B
B1
C
C1
D
E
E1
Y
-
5.90
-
7.90
-
0.40
-
0.25
-
Typ
0.75
6.00
3.75
8.00
5.25
0.45
Max
-
6.10
-
8.10
-
0.50
1.00
-
0.10
Revision 2.0
September 2004
C
E1
E
