L-05C6N8KV4Y
| Model | L-05C6N8KV4Y |
| Description | 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP |
| PDF file | Total 4 pages (File size: 75K) |
| Chip Manufacturer | JOHANSON |
RF C
HARACTERISTICS
C
HARACTERISTICS
(T
YPICAL
)
INDUCTANCE VS FREQUENCY: SIZE 0402
500
Q VS FREQUENCY: SIZE 0402
100
1N5
80
Inductance (nH)
100
47N
27N
15N
10
60
3N3
6N8
15N
Q
40
6N8
3N3
1N5
1.0
0.01
0.1
1.0
10
20
47N
0
0.01
0.1
1.0
27N
10
Frequency (GHz)
Frequency (GHz)
INDUCTANCE VS FREQUENCY: SIZE 0603
1000
Q VS FREQUENCY: SIZE 0603
100
2N2
80
Inductance (nH)
100
R10
56N
60
4N7
12N
Q
40
27N
56N
20
R10
0
0.01
27N
12N
10
4N7
2N2
1.0
0.01
0.1
1.0
10
0.1
1.0
10
Frequency (GHz)
Frequency (GHz)
INDUCTANCE VS FREQUENCY: SIZE 0805
1000
Q VS FREQUENCY: SIZE 0805
150
2N2
Inductance (nH)
100
R15
R10
56N
100
4N7
12N
27N
56N
R10
R15
0.1
1.0
10
12N
10
4N7
2N2
1.0
Q
50
0
0.01
27N
0.01
0.1
1.0
10
Frequency (GHz)
Frequency (GHz)
M
ECHANICAL
& E
NVIRONMENTAL
C
HARACTERISTICS
SPECIFICATION
SOLDERABILITY:
RESISTANCE TO SOLDERING:
THERMAL SHOCK:
LIFE TEST:
HUMIDITY RESISTANCE:
TERMINAL ADHESION:
PCB DEFLECTION:
Solder coverage 75% of electrodes L=±10% Q=± 20%
No apparent damage Solder coverage 75% L=±10% Q=± 20%
No apparent damage L=±10% Q=± 20%
No apparent damage L=±10% Q=± 20%
Inductance change: 2% or .5pF Max
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
TEST PARAMETERS
Preheat 120±20°C for 1 min. Dip 230±10°C for 3±1 sec.
Preheat 120±20°C for 1 min. Dip 260±10°C for 10±1 sec.
100 cycles: 30±3 minutes @ +100°C then 30±3 min. @ -40°C
1000 ±48 Hours @ +85±2°C, rated current (1-2 hour recovery)
1000 ±48 Hours @ +40±2°C, 90-95% relative humidity,
rated current (1-2 hour recovery)
Lateral pull force: 0201 1.0Lbs 0402 1.6Lbs
For 0603 2.2Lbs For 0805 4.4Lbs
Glass Epoxy PCB: 1 mm deflection
www.johansontechnology.com
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