L177HDE15SD0CH3F
| Model | L177HDE15SD0CH3F |
| Description | D Subminiature Connector, 15 Contact(s), Female, Solder Terminal, Socket, ROHS COMPLIANT |
| PDF file | Total 4 pages (File size: 4M) |
| Chip Manufacturer | AMPHENOL |
HD
D-Sub connectors - Stamped and Formed Contacts
RIGHT ANGLE
HIGH DENSITY CONNECTORS
MAIN CHARACTERISTICS
• Connectors according to: MIL C24308
Materials and Platings
Shells
Body
Contacts
Rear insert
Screwlock
Grounding clip
Steel with nickel plating
Glass filled thermoplastic, UL 94V-0
Copper alloy, selective gold plating
Brass with nickel plating
Brass with nickel plating
Copper alloy with tin plating
DESCRIPTION
APPLICATIONS
Unmate (min)
0.52 (1.14)
1.05 (2.32)
1.37 (3.02)
1.76 (3.88)
Specifications
Amphenol’s high density
D-Sub connectors complement
Amphenol’s extensive D-Sub
connector line. This line offers many
superior features, high performance
level and low installation cost.
The decreased contact spacing
accommodates greater signal
density in comparison to conventional
D-Sub connectors.
Electrical Data
Current rating
Voltage rating
Withstanding voltage
Insulation resistance
Contact resistance
5A
600V AC/rms 50Hz
1000V AC/rms 50HZ for one minute
5000MΩ
10mΩ Max.
Economical
right angle PCB
Climatic Data
Operating temperature
-55°C to +125°C
Mechanical Data
Mating and unmating force
Unit: kg (lb)
No. of Cts
15
26
44
62
Mate (max)
3.81 (8.42)
5.95 (13.16)
9.26 (20.46)
13.48 (29.78)
• Industrial
• Telecom
• Any industry standard
I / O connections
Standard plating thickness
•
gold flash
• 0.4µm (15µ”) gold
• 0.76µm (30µ”) gold
HD / E19
