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M1001-12927

M1001-12927

Model M1001-12927
Description Board Connector
PDF file Total 8 pages (File size: 769K)
Chip Manufacturer AMPHENOL
NAFI
TECHNICAL REFERENCES
OPERATING CHARACTERISTICS
Temperature Range
Current Rating
(individual contact)
Current Rating
(multiple contacts)
Dielectric Withstanding
Voltage (DWV)
Insulation Resistance (min.)
Contact Resistance (max.)
Contact-to-Backplane
Retention Force (min.)
Contact Life (durability)
Contact Engagement Force
Contact Normal Force
Contact Wipe Length (min.)
-65°C to +125°C
3 Amps DC at 25°C
1 Amp DC at °C
600 V (RMS) at 60 Hz
10,000 MΩ
30 MΩ
3.0 lbs.
500 cycles
2.25 oz max. average
1.0 N (3.53 oz-f) average
0.053 in.
MATERIALS & FINISHES
Frame Material
Frame Finish
Module Contact Material
Module Contact Tails
Module Contact Finish
Backplane Contact Material
Backplane Contact Finish
Module Insulator
Backplane Insulator
Module Marking
Polarizing Keys and Bushings
Aluminum Alloy
Gold Chromate per MIL-C-5541
Brass
Pre-tinned using Sn63 (from end of
contact to mounting surface min.)
50µ” min. Gold over 10µ” min. Nickel
Beryllium Copper
50µ” min. Gold over 10µ” min. Nickel
High-temperature Nylon 6-6
Polyester, 30% glass-filled (UL 94V-0)
Includes Amphenol part number, logo and
date code
Stainless Steel, Passivated
ENVIRONMENTAL CHARACTERISTICS
Salt Spray (corrosion)
Thermal Shock
Humidity
Physical Shock
Vibration (random)
MIL-STD-1344
MIL-STD-1344
MIL-STD-810
MIL-STD-202
MIL-STD-1344
Method 1001, Test Condition B
Method 1003, -55°C to +125°C
Method 507, Procedure 1
Method 213
Method 2005, 10-2000 Hz, 15g Peak
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