N08M1618L1AB-85I
| Model | N08M1618L1AB-85I |
| Description | Standard SRAM, 512KX16, 85ns, CMOS, PBGA48, BGA-48 |
| PDF file | Total 11 pages (File size: 195K) |
| Chip Manufacturer | AMI |
AMI Semiconductor, Inc.
Ball Grid Array Package
A1 BALL PAD
CORNER (3)
D
0.20±0.05
1.10±0.10
N08M1618L1A
Advance Information
1. 0.30±0.05 DIA.
E
2. SEATING PLANE - Z
0.15 Z
0.05
TOP VIEW
SIDE VIEW
1. DIMENSION IS MEASURED AT THE
A1 BALL PAD
MAXIMUM SOLDER BALL DIAMETER.
CORNER
PARALLEL TO PRIMARY Z.
2. PRIMARY DATUM Z AND SEATING
PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE
SOLDER BALLS.
3. A1 BALL PAD CORNER I.D. TO BE
MARKED BY INK.
K TYP
J TYP
e
Z
SD
e
SE
BOTTOM VIEW
Dimensions (mm)
e = 0.75
D
8±0.10
E
SD
10±0.10
0.375
SE
0.375
J
2.125
K
2.375
BALL
MATRIX
TYPE
FULL
Stock No. 23211-03 9/21/06
ADVANCE INFORMATION
The specifications of this device are subject to change without notice. For latest documentation see http://www.amis.com.
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