P03A
| Model | P03A |
| Description | POWER OPERATIONAL AMPLIFIERS |
| PDF file | Total 4 pages (File size: 103K) |
| Chip Manufacturer | ETC |
POWER OPERATIONAL AMPLIFIERS
PA03 • P03A
M I C R O T E C H N O L O G Y
HTTP://WWW.APEXMICROTECH.COM
(800) 546-APEX
(800) 546-2739
FEATURES
• MO-127 COPPER POWER DIP™ PACKAGE
• HIGH INTERNAL POWER DISSIPATION
— 500 watts
• HIGH VOLTAGE OPERATION —
±75V
• VERY HIGH CURRENT —
±30
amps
• INTERNAL SOA PROTECTION
• OUTPUT SWINGS CLOSE TO SUPPLY RAILS
• EXTERNAL SHUTDOWN CONTROL
APPLICATIONS
•
•
•
•
LINEAR AND ROTARY MOTOR DRIVES
YOKE/MAGNETIC FIELD DEFLECTION
PROGRAMMABLE POWER SUPPLIES to
±68V
TRANSDUCER/AUDIO TO 1000W
TYPICAL APPLICATION
+V
S
POSITION
FEEDBACK
R
BAL
+5V
SHUT DOWN
0/10V
DAC
R1
DESIRED
POSITION
+
+S
–S PA03
–
–V
S
C
1
R2
DESCRIPTION
The super power PA03 advances the state of the art in both
brute force power and self protection against abnormal oper-
ating conditions. Its features start with a copper dip package
developed by Apex to extend power capabilities well beyond
those attainable with the familiar TO-3 package. The in-
creased pin count of the new package provides additional
control features, while the superior thermal conductivity of
copper allows substantially higher power ratings.
The PA03 incorporates innovative current limiting circuits
limiting internal power dissipation to a curve approximating the
safe operating area of the power transistors. The internal
current limit of 35A is supplemented with thermal sensing
which reduces the current limit as the substrate temperature
rises. Furthermore, a subcircuit monitors actual junction tem-
peratures and with a response time of less than ten millisec-
onds reduces the current limit further to keep the junction
temperature at 175°C.
The PA03 also features a laser trimmed high performance
FET input stage providing superior DC accuracies both initially
and over the full temperature range.
OBJECT
TOOL
The PA03 output power stages contain fast reverse recov-
ery diodes for sustained high energy flyback protection.
This hybrid integrated circuit utilizes thick film resistors,
ceramic capacitors and silicon semiconductors to maximize
reliability, minimize size and give top performance. Ultrasoni-
cally bonded aluminum wires provide reliable interconnec-
tions at all operating temperatures. The MO-127 Copper,
12-pin Power Dip™ package (see Package Outlines), is
hermetically sealed and isolated from the internal circuits.
Insulating washers are not recommended.
IMPORTANT: Observe mounting precautions.
EQUIVALENT
SCHEMATIC
8
11
12
+V
BAL
BAL
D1
Q2
Q5
Q17
Q3
Q12
4
+SHUT
Q18 DOWN
Q22
3
–SHUT
DOWN
Q14
9
COMP
10
Q19
Q24
Q30
Q16
Q6 Q7
Q9
D2
Q1
Q4
+
7
6
–
1
–
OUT
Q20
A
Q20
B
2
+
Q31
Q29
Q32
Q26
D3
D4
5
–V
Q34
APEX MICROTECHNOLOGY CORPORATION
• TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
