S101D01
| Model | S101D01 |
| Description | 16-Pin DIP Type SSR for Low Power Control |
| PDF file | Total 4 pages (File size: 71K) |
| Chip Manufacturer | SHARP |
S101D01/S101D02/S201D01/S201D02
Fig.11 Turn-on Time vs. Forward Current
(S101D02 , S201D02 )
100
V
D
= 6V
R
L
= 100Ω
T
a
= 25˚C
Turn-on time t
on
(
µ
s )
Turn-on time t
on
(
µ
s )
50
40
30
100
Fig.12 Turn-on Time vs. Forward Current
(S201D01)
200
V
D
= 6V
R
L
= 100Ω
T
a
= 25˚C
50
40
30
20
10
10
20
30
40 50
Forward current I
F
( mA )
100
20
10
20
30
40 50
Forward current I
F
( mA )
100
s
Basic Operation Circuit
R
1
+
V
CC
D
1
3
V
1
Tr1
Z
S
:
Surge absorption circuit
2
SSR
11
13
Z
S
Load
AC 100V (
S101D01
/
S101D02
)
AC 200V (
S201D01
/
S201D02
)
( 1 ) DC Drive
AC supply voltage
Input signal
Load current
( for resistance load)
( 2 ) Pulse Drive
( 3 ) Phase Control
9
Notes 1 ) If large amount of surge is loaded onto V
CC
or the driver circuit, add a diode D
1
between terminals 2
and 3 to prevent reverse bias from being applied to the infrared LED.
2 ) Be sure to install a surge absorption circuit.
An appropriate circuit must be chosen according to the load ( for CR, choose its constant ) . This must be
carefully done especially for an inductive load.
3 ) For phase control, adjust such that the load current immediately after the input signal is applied will be
more than 60mA.
( Precautions for Use )
1 ) All pins must be soldered since they are also used as heat sinks ( heat radiation fins ) . In designing, take into the
heat radiation from the mounted SSR.
2 ) For higher radiation efficiency that allows wider thermal margin, secure a wider round pattern for Pin 13 when
designing mounting pattern. The rounded part of Pin 15 ( gate ) must be as small as possible. Pulling the gate
pattern around increases the change of being affected by external noise.
3 ) As for other general cautions, refer to the chapter “ Precautions for Use ”
