U0402FC08C-LF-T710-1
| Model | U0402FC08C-LF-T710-1 |
| Description | Trans Voltage Suppressor Diode, 250W, 8V V(RWM), Bidirectional, 1 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-4 |
| PDF file | Total 8 pages (File size: 571K) |
| Chip Manufacturer | PROTEC |
05149
Only One Name Means ProTek’Tion™
U0402FC3.3C - U0402FC36C
250w UnbUmPed FliP ChiP tvs aRRay
desCRiPtion
The U0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level
transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed
specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These
devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per
line for an 8/20µs waveform. In addition, the U0402FCxxC series features superior clamping performance, low leak-
age current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates
overshoot voltage due to package inductance.
U0402 PaCkage
FeatURes
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Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional Configuration and Monolithic Structure
Protection for 1 Line
RoHS Compliant
REACH Compliant
aPPliCations
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Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
meChaniCal ChaRaCteRistiCs
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Standard EIA Chip Size: 0402
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Plastic Tape per EIA Standard 481
Pin ConFigURation
05149.R6 2/11
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