U0402FC12C-T75-1-LF
| Model | U0402FC12C-T75-1-LF |
| Description | Trans Voltage Suppressor Diode, 250W, 12V V(RWM), Bidirectional, 1 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-4 |
| PDF file | Total 8 pages (File size: 571K) |
| Chip Manufacturer | PROTEC |
05149
Only One Name Means ProTek’Tion™
U0402FC3.3C - U0402FC36C
soldeR ReFlow inFoRmation
PRinted CiRCUit boaRd ReCommendations
PaRameteR
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity (Only applies to bumped devices)
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP (Entek Cu Plus 106A)
±50µm
±20µm
60 seconds
270°C
valUe
ReqUiRements
Temperature:
T
P
for Lead-Free (Sn/Ag/Cu): 260-270°C
Preheat time and temperature depends on solder paste and flux activa-
tion temperature, component size, weight, surface area and plating.
ReCommended non-soldeR mask
deFined Pad illUstRation
non-solder mask defined Pad
0.275mm dia.
solder mask opening
0.325mm dia.
solder stencil opening
0.330mm dia.
maximum solder Reflow
(35-53°C above maximum solder melt temp)
t
P
temperature - °C
Ramp-Up
solder melt
(maximum temp)
Ramp-down
Preheat
(stay below Flux activation temp)
30-60 seconds
Ramp-Up
15 seconds
(minimize)
Page 5
solder-time
15-20 seconds
Ramp-down
05149.R6 2/11
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