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W3EG7232S335BD4SG

W3EG7232S335BD4SG

Model W3EG7232S335BD4SG
Description DDR DRAM Module, 32MX72, 0.7ns, CMOS, ROHS COMPLIANT, SODIMM-200
PDF file Total 14 pages (File size: 325K)
Chip Manufacturer MICROSEMI
White Electronic Designs
W3EG7232S-xAD4
-xBD4
256MB – 32Mx72 DDR SDRAM UNBUFFERED w/PLL
FEATURES
Double-data-rate architecture
DDR200, DDR266 and DDR300
• JEDEC design specifications
Bi-directional data strobes (DQS)
Differential clock inputs (CK & CK#)
Programmable Read Latency 2,2.5 (clock)
Programmable Burst Length (2,4,8)
Programmable Burst type (sequential & interleave)
Edge aligned data output, center aligned data input
Auto and self refresh
Serial presence detect
Power supply: 2.5V ± 0.2V
JEDEC standard 200 pin SO-DIMM package
• Package height options:
AD4: 35.5 mm (1.38") and
BD4: 31.75 mm (1.25")
NOTE: Consult factory for availability of:
• RoHS compliant products
• Vendor source control options
• Industrial temperature option
* This product is subject to change without notice.
DESCRIPTION
The W3EG7232S is a 32Mx72 Double Data Rate
SDRAM memory module based on 256Mb DDR SDRAM
components. The module consists of nine 32Mx8 DDR
SDRAMs in 66 pin TSOP packages mounted on a 200
pin FR4 substrate.
Synchronous design allows precise cycle control with the
use of system clock. Data I/O transactions are possible on
both edges and Burst Lengths allow the same device to be
useful for a variety of high bandwidth, high performance
memory system applications.
OPERATING FREQUENCIES
DDR333 @CL=2.5
Clock Speed
CL-t
RCD
-t
RP
166MHz
2.5-3-3
DDR266 @CL=2
133MHz
2-2-2
DDR266 @CL=2.5
133MHz
2.5-3-3
DDR200 @CL=2
100MHz
2-2-2
March 2007
Rev. 5
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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