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Home > Data Sheet > W3H32M72E-400SB2CF
W3H32M72E-400SB2CF

W3H32M72E-400SB2CF

Model W3H32M72E-400SB2CF
Description DDR DRAM, 32MX72, 0.6ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208
PDF file Total 26 pages (File size: 1M)
Chip Manufacturer MICROSEMI
W3H32M72E-XSB2X
W3H32M72E-XSB2XF
256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
FEATURES

Data rate = 667, 533, 400

Package:
• 208 Plastic Ball Grid Array (PBGA), 16 x 20mm
• 1.0mm pitch

Differential data strobe (DQS, DQS#) per byte

Internal, pipelined, double data rate architecture

4-bit prefetch architecture

DLL for alignment of DQ and DQS transitions with clock
signal

Four internal banks for concurrent operation
(Per DDR2 SDRAM Die)

Programmable Burst lengths: 4 or 8

Auto Refresh and Self Refresh Modes

On Die Termination (ODT)

Adjustable data – output drive strength

Single 1.8V ±0.1V supply

Programmable CAS latency: 3, 4, 5, or 6

Posted CAS additive latency: 0, 1, 2, 3 or 4

Write latency = Read latency - 1* t
CK

Commercial, Industrial and Military Temperature Ranges

Organized as 32M x 72

Weight: W3H32M72E-XSB2X - 2.5 grams typical
BENEFITS

69% space savings vs. FPBGA

Reduced part count

54% I/O reduction vs FPBGA

Reduced trace lengths for lower parasitic capacitance

Suitable for hi-reliability applications

Upgradable to 64M x 72 density (contact factory for
information)

Lead free - available (Pb free – component and material are
lead free in accordance with IPC-1752)
* This product is subject to change without notice.
TYPICAL APPLICATION
RAM
Host
FPGA/
Processor
DDR2/DDR3
W3X128M72-XBI
SSD (SLC)
MSM32/MSM64 (SATA BGA)
W7N16GVHxxBI (PATA BGA)
n)
M512/M256/M128 (SATA, 2.5in)
FIGURE 1 – DENSITY COMPARISONS
CSP Approach (mm)
11.0
11.0
11.0
11.0
11.0
W3H32M72E-XSB2X
20
19.0
90
FBGA
90
FBGA
90
FBGA
90
FBGA
90
FBGA
W3H32M72E-XSB2X
16
S
A
V
I
N
G
S
69%
54%
Area
I/O Count
5 x 209mm
2
= 1,045mm
2
5 x 90 balls = 450 balls
320mm
2
208 Balls
Microsemi Corporation reserves the right to change products or specifications without notice.
December 2013
Rev. 9
© 2013 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
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