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Home > Data Sheet > W3HG128M64EEU806D4IMG
W3HG128M64EEU806D4IMG

W3HG128M64EEU806D4IMG

Model W3HG128M64EEU806D4IMG
Description DDR DRAM Module, 128MX64, 0.45ns, CMOS, ROHS COMPLIANT, SODIMM-200
PDF file Total 14 pages (File size: 222K)
Chip Manufacturer MICROSEMI
White Electronic Designs
W3HG128M64EEU-D4
ADVANCED*
1GB – 128Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM
FEATURES
200-pin, Small-Outline DIMM (SO-DIMM), Raw
Card "B"
Fast data transfer rates: PC2-6400*, PC2-5300*,
PC2-4200 and PC2-3200
Utilizes 800*, 667*, 533 and 400 Mb/s DDR2
SDRAM components
V
CC
= V
CCQ
= 1.8V ± 0.1V
V
CCSPD
= 1.7V to 3.6V
JEDEC standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
Four-bit prefetch architecture
DLL to align DQ and DQS transitions with CK
Multiple internal device banks for concurrent
operation
Supports duplicate output strobe (RDQS/RDQS#)
Programmable CAS# latency (CL): 3, 4, 5* and 6*
Adjustable data-output drive strength
On-Die Termination (ODT)
Posted CAS# latency: 0, 1, 2, 3 and 4
Serial Presence Detect (SPD) with EEPROM
64ms: 8,192 cycle refresh
Gold edge contacts
Single Rank
RoHS Compliant
JEDEC Package option
• 200 Pin (SO-DIMM)
• PCB – 29.20mm (1.150") TYP
NOTE: Consult factory for availability of:
• Vendor source control options
• Industrial temperature option
DESCRIPTION
The W3HG128M64EEU is a 128Mx64 Double Data Rate
2 SDRAM memory module based on 1Gb DDR2 SDRAM
components. The module consists of eight 128Mx8, in
FBGA package mounted on a 200 pin SO-DIMM FR4
substrate.
* This product is under development, is not qualified or characterized and is subject to
change or cancellation without notice.
OPERATING FREQUENCIES
PC2-6400*
Clock Speed
CL-t
RCD
-t
RP
* Consult factory for availability
PC2-5300*
333MHz
5-5-5
PC2-4200
266MHz
4-4-4
PC2-3200
200MHz
3-3-3
400MHz
6-6-6
November 2006
Rev. 2
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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