W72M64V-120BI
| Model | W72M64V-120BI |
| Description | Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| PDF file | Total 2 pages (File size: 209K) |
| Chip Manufacturer | WEDC |
2M x 64 Flash
Multi-Chip Package
Optimum Density and Performance
in One Package
W72M64V-XBX Features
Designed to complement PowerPC™ high performance memory
controllers (see page 2 for typical application block diagram)
Performance Features
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Simultaneous Read/Write operations
- Data can be continuously read from one bank
while executing erase/program functions in
other bank
- Zero latency between read and write operations
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Zero Power Operation
16MByte (128Mb) organized as 2Mx64
Access Times of 100, 120, 150ns
1,000,000 Erase/Program Cycles per sector
Sector Architecture
- Bank 1: Eight 4KWord, fifteen 32KWord
Bank 2: Forty-Eight 32K Word
- Any combination of sectors can be concurrently
erased. Also supports full chip erase.
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Boot Code Sector Architecture (Bottom)
3.3V for Read and Write Operations
Commercial, industrial and military temperature
ranges
Benefits
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70% space savings
Reduced part count
17% I/O reduction
Suitable for high-reliability
applications
Upgradeable to 8Mx64
(contact factory for
future availability)
Package
-
13x22mm, 159 Plastic Ball Grid Array (PBGA),
286mm
2
For more information, visit our website at
www.wedc.com
or call (602) 437-1520 and ask for applications support.
* This product is subject to change without notice.
PowerPC™ is a trademark of International Business Machines Corp.
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