X1227V8T1
| Model | X1227V8T1 |
| Description | REAL TIME CLOCK, PDSO8, PLASTIC, TSSOP-8 |
| PDF file | Total 28 pages (File size: 422K) |
| Chip Manufacturer | RENESAS |
X1227
ABSOLUTE MAXIMUM RATINGS
Temperature Under Bias ................... -65°C to +135°C
Storage Temperature ........................ -65°C to +150°C
Voltage on V
CC
, V
BACK
pin
(respect to ground)...............................-0.5V to 7.0V
Voltage on SCL, SDA, X1 and X2
pin (respect to ground) ............... -0.5V to 7.0V or 0.5V
above V
CC
or V
BACK
(whichever is higher)
DC Output Current .............................................. 5 mA
Lead Temperature (Soldering, 10 sec) .............. 300°C
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation
of the device at these or any other conditions above
those indicated in the operational sections of this
specification is not implied. Exposure to absolute max-
imum rating conditions for extended periods may
affect device reliability.
DC OPERATING CHARACTERISTICS
(Temperature = -40°C to +85°C, unless otherwise stated.)
Symbol
V
CC
V
BACK
V
CB
V
BC
Parameter
Main Power Supply
Backup Power Supply
Switch to Backup Supply
Switch to Main Supply
Conditions
Min
2.7
1.8
V
BACK
-0.2
V
BACK
Typ
Max
5.5
5.5
V
BACK
-0.1
V
BACK
+0.2
Unit
V
V
V
V
Notes
OPERATING CHARACTERISTICS
Symbol
I
CC1
I
CC2
I
CC3
I
BACK
Parameter
Read Active Supply
Current
Program Supply Current
(nonvolatile)
Main Timekeeping
Current
Timekeeping Current –
(Low Voltage Sense
and Watchdog Timer
disabled
Input Leakage Current
Output Leakage Current
Input LOW Voltage
Input HIGH Voltage
Schmitt Trigger Input
Hysteresis
Output LOW Voltage for
SDA and RESET
Conditions
V
CC
= 2.7V
V
CC
= 5.0V
V
CC
= 2.7V
V
CC
= 5.0V
V
CC
= 2.7V
V
CC
= 5.0V
V
BACK
= 1.8V
V
BACK
= 3.3V
Min
Typ
Max
400
800
2.5
3.0
10
20
Unit
µA
µA
mA
mA
µA
µA
µA
µA
Notes
1, 5, 7, 14
2, 5, 7, 14
3, 7, 8, 14, 15
3, 6, 9, 14, 15
“See Perfor-
mance Data”
1.25
1.5
10
10
-0.5
V
CC
x 0.7 or
V
BACK
x 0.7
V
CC
x 0.2 or
V
BACK
x 0.2
V
CC
+ 0.5 or
V
BACK
+ 0.5
I
LI
I
LO
V
IL
V
IH
V
HYS
V
OL1
µA
µA
V
V
V
10
10
13
13
13
11
V
CC
related level
V
CC
= 2.7V
V
CC
= 5.5V
.05 x V
CC
or
.05 x V
BACK
0.4
0.4
V
Notes: (1) The device enters the Active state after any start, and remains active: for 9 clock cycles if the Device Select Bits in the Slave Address
Byte are incorrect or until 200nS after a stop ending a read or write operation.
(2) The device enters the Program state 200nS after a stop ending a write operation and continues for t
WC
.
(3) The device goes into the Timekeeping state 200nS after any stop, except those that initiate a nonvolatile write cycle; t
WC
after a stop
that initiates a nonvolatile write cycle; or 9 clock cycles after any start that is not followed by the correct Device Select Bits in the Slave
Address Byte.
(4) For reference only and not tested.
(5) V
IL
= V
CC
x 0.1, V
IH
= V
CC
x 0.9, f
SCL
= 400KHz
(6) V
CC
= 0V
(7) V
BACK
= 0V
(8) V
SDA
= V
SCL
=V
CC
, Others = GND or V
CC
4
FN8099.1
September 15, 2005
