X1G004691024514
| Model | X1G004691024514 |
| Description | Clipped Sine Output Oscillator, |
| PDF file | Total 8 pages (File size: 507K) |
| Chip Manufacturer | SEIKO |
[ 11 ] Handling precautions
Prior to using this product, please carefully read the section entitled “Precautions” on our Web site
( http://www5.epsondevice.com/en/quartz/tech/precaution/ ) for instructions on how to handle and use
the product properly to ensure optimal performance of the product in your equipment.
Before using the product under any conditions other than those specified therein,
please consult with us to verify and confirm that the performance of the product will not be negatively
affected by use under such conditions.
In addition to the foregoing precautions, in order to avoid the deteriorating performance of the product,
we strongly recommend that you DO NOT use the product under ANY of the following conditions:
(1) Mounting the product on a board using water-soluble solder flux and using the product without
removing the residue of the flux completely from the board. The residue of such flux that is soluble
in water or water-soluble cleaning agent, especially the residues which contains active halogens,
will negatively affect the performance and reliability of the product.
(2) Using the product in any manner that will result in any shock or impact to the product.
(3) Using the product in places where the product is exposed to water, chemicals, organic solvent,
sunlight, dust, corrosive gasses, or other materials.
(4) Using the product in places where the product is exposed to static electricity or electromagnetic
waves.
(5) Applying ultrasonic cleaning without advance verification and confirmation that the product will
not be affected by such a cleaning process, because it may damage the crystal,
IC and/or metal line of the product.
(6) Touching the IC surface with tweezers or other hard materials directly.
(7) Using the product under any other conditions that may negatively affect the performance and/or
reliability of the product.
(8) Power supply with ripple may cause of incorrect operation or degradation of phase noise characteristics,
so please evaluate before use.
(9) Frequency aging is from environmental tests results to the expectation of the amount
of the frequency variation. This doesn't guarantee the product-life cycle.
(10)This components used underfill material at the back side of package.
After mounting this components on the board, there’s possibility of IC damage happened
by thermal expansion of adhesive, if adhesive will break into between TCXO and the board.
Please do not use adhesive, this will cause oscillation stop in case of IC damaged by adhesive.
Should any customer use the product in any manner contrary to the precautions and/or advice herein,
such use shall be done at the customer’s own risk.
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