GD32F103C8T6 Memory chips

The GD32F103xx device incorporates the ARM ® Cortex™ M3 32- bit processor core operating at 108 MHz frequency with Flash acce sses zero wait states to obtain maximum efficiency. It provides up to 3 M B on- chip Flash memory and up to 96 KB SRAM memory . An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer up to t hree 12-bit ADCs, up to two 1 2-bit DACs, up to ten general -purpose 16- bit timers , two basic timers plus two PWM advanced- control timer, as well as standard and advanced communication interfaces: up to threeSPIs , two I 2 Cs, three USARTs, two UARTs, two I 2 Ss, an USB 2.0 FS , a CAN and a SDIO .

The device operates from a 2. 6 to 3.6 V power supply and available in –40 to +85 °C temperature range. Several power saving modes provide the flexibility for maximum optimization between wakeup latency and power consumption, an especially important consideration in low power applications.

The above features make the GD32F103xx device s suitable for a wide range of applications, especially in areas such as industrial control, motor drives, power monitor and alarm systems, consumer and handheld equipment, POS, vehicle GPS, video intercom , PC peripherals and so on.