B1101U
| Model | B1101U |
| Description | solid state crowbar devices |
| PDF file | Total 212 pages (File size: 2M) |
| Chip Manufacturer | TECCOR |
Package Dimensions
MS-013
The MS-013 is designed to meet mechanical standards as set forth in JEDEC publication
number 95.
K
J
E
PAD OUTLINE
[.065]
1.65
[.460]
11.68
[.138]
3.50
1
FH
F
7 ˚ TYP
A
B
MOLD SPLIT LINE
A
G
7 ˚ TYP
M
X
[.059]
1.50
W
BURR SIDE
96 ˚
R
4˚
P
N
MIN LENGTH U
OF FLAT
T
0.08
DETAIL A
SCALE 20:1
D
C
7 ˚ TYP
A
L
7 ˚ TYP
Inches
Dimension
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
W
X
0.293
0.289
0.089
0.045
0.034
0.008
0.036
0.020
0.010
0.023
0.010
0.023
MIN
0.360
0.348
0.352
0.138
0.400
MAX
0.364
0.352
0.356
0.138
0.412
0.051
0.043
0.051
0.118
0.089
0.293
0.293
0.093
0.045
0.036
0.008
0.036
0.30
7.34
2.26
1.14
0.86
0.20
0.91
0.51
0.25
0.58
MIN
9.14
8.84
8.94
3.51
10.16
Millimeters
MAX
9.25
8.94
9.04
3.51
10.46
1.30
1.09
1.30
3.00
2.26
7.44
7.44
2.36
1.14
0.91
0.20
0.91
0.25
0.58
Notes:
• Dimensions and tolerances per ASME Y14.5M-1982
• Mold flash shall not exceed 0.13 mm per side.
• All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
http://www.teccor.com
+1 972-580-7777
6-6
SIDACtor
®
© 2002 Teccor Electronics
Data Book and Design Guide
