B1101U
| Model | B1101U |
| Description | solid state crowbar devices |
| PDF file | Total 212 pages (File size: 2M) |
| Chip Manufacturer | TECCOR |
Packing Options
TeleLink Surface Mount Fuse
The following illustration shows the
TeleLink
embossed carrier tape:
.436±.004
(3.15±.10)
.124±.004
(1.75±.10)
.157±.004
(4.00±.10)
'A'
.079±.004
(2.00±.10)
.059±.004 Dia.
(1.50±.10)
.453±.004
(11.50±.10)
'B'
.436±.004
(11.07±.10)
+.012
.945 -.004
(24.00) +.30
-.10
4˚ Max.
.0135±.0005
(.343±.013)
Section 'A'-'A'
'A'
.315±.004
(8.00±.10)
.129±.004
(3.28±.10)
.059±.010 Dia.
(1.50±.25)
'B'
24 mm Black
Anti-static Carrier Tape
Dimensions are in inches
(and millimeters)
8˚ Max.
http://www.teccor.com
+1 972-580-7777
6 - 18
SIDACtor
®
© 2002 Teccor Electronics
Data Book and Design Guide
