B3204U
| Model | B3204U |
| Description | solid state crowbar devices |
| PDF file | Total 212 pages (File size: 2M) |
| Chip Manufacturer | TECCOR |
SIDACtor Soldering Recommendations
not exceed 275 °C and the maximum temperature of the plastic body does not exceed
250 °C. (Figure 5.8)
Transport
Vapor lock
(secondary
medium)
Vapor phase
zone
Cooling pipes
PC board
Heating
elements
Boiling liquid (primary medium)
Figure 5.7
Principle of Vapor Phase Soldering
260
240
220
Pre-heat
Soak
Peak Temperature
220
˚
C - 245
˚
C
1.3 - 1.6
˚
C/s
Reflow
Cool
Down
Temperature – ˚C
200
180
160
140
120
100
80
60
40
20
0
30
60
90
<2.5
˚
C/s
0.5 - 0.6
˚
C/s
<2.5
˚
C/s
Soaking Zone
60 - 90 s typical
( 2 min. MAX )
Reflow Zone
30 - 60 s typical
( 2 min. MAX )
Pre-heating Zone
( 2-4 min MAX )
120
150
180
210
240
270
300
Time (Seconds)
Figure 5.8
Reflow Soldering Profile
During reflow, the surface tension of the liquid solder draws the leads of the device towards
the center of the soldering area, correcting any misalignment that may have occurred
during placement and allowing the device to set flush on the pad. If the footprints of the pad
are not concentrically aligned, the same effect can result in undesirable shifts as well.
Therefore, it is important to use a standard contact pattern which leaves sufficient room for
self-positioning.
After the solder cools, connections should be visually inspected and remnants of the flux
removed using a vapor degreaser with an azeotrope solvent or equivalent.
© 2002 Teccor Electronics
SIDACtor
®
Data Book and Design Guide
5 - 23
http://www.teccor.com
+1 972-580-7777
Technical Notes
0
