C0402C473M8PAC7867
| Model | C0402C473M8PAC7867 |
| Description | Cap,Ceramic,47nF,10VDC,20% -Tol,20% +Tol,X5R TC Code,-15,15% TC,0402 Case |
| PDF file | Total 18 pages (File size: 890K) |
| Chip Manufacturer | KEMET |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
ØDo
P
2
Po
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E
1
A
0
F
Bottom Cover Tape
B
0
E
2
W
T
1
T
1
Top Cover Tape
Center Lines of Cavity
P
1
G
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
D
0
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
E
1
1.75 ±0.10
(0.069 ±0.004)
P
0
4.0 ±0.10
(0.157 ±0.004)
P
2
2.0 ±0.05
(0.079 ±0.002)
T
1
Max
0.10
(0.004) Maximum
G Minimum
0.75
(0.030)
R Ref.
Note 2
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
8 mm
Pitch
Half (2 mm)
Single (4 mm)
E2 Minimum
6.25
(0.246)
F
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
P
1
T Maximum
1.1
(0.098)
W Maximum
8.3
(0.327)
8.3
(0.327)
A
0
B
0
Note 1
1. The cavity defined by A
0
, B
0
and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 5).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1006_X5R_SMD • 5/7/2012
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