C0402T609J5GCC
| Model | C0402T609J5GCC |
| Description | Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000006uF, Surface Mount, 0402, CHIP, ROHS COMPLIANT |
| PDF file | Total 18 pages (File size: 1M) |
| Chip Manufacturer | KEMET |
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Dimensions – Millimeters (Inches)
T
W
L
B
100% Tin or SnPb Plate
S
Nickel Plate
Electrodes
Conductive Metalization
EIA
Size
Code
0402
0603
0805
1206
1210
1812
2220
Metric
Size
Code
1005
1608
2012
3216
3225
4532
5650
L
Length
1.00 (.040) ± 0.05 (.002)
1.60 (.063) ± 0.15 (.006)
2.00 (.079) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008)
4.50 (.177) ± 0.30 (.012)
W
Width
0.50 (.020) ± 0.05 (.002)
0.80 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.20 (.008)
1.60 (.063) ± 0.20 (.008)
2.50 (.098) ± 0.20 (.008)
3.20 (.126) ± 0.30 (.012)
T
Thickness
See Table 2 for Thickness
B
Bandwidth
0.30 (.012) ± 0.10 (.004)
0.35 (.014) ± 0.15 (.006)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
S
Separation
Min.
0.30 (.012)
0.70 (.028)
0.75 (.030)
N/A
Mounting
Technique
Solder Reflow Only
Solder Wave or
Solder Reflow
Solder Reflow Only
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)
Benefits
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-55°C to +125°C operating temperature range
Voltage conditioning and post-electrical testing per MIL-PRF-55681, Paragraph 4.8.3.1, Standard Voltage Conditioning
Destructive Physical Analysis (DPA) per EIA-469
Humidity, steady state, low voltage (85/85) per MIL-STD 202, Method 103, Condition A
Certificate of compliance
RoHS compliant (excluding SnPb end metallization option)
EIA 0201, 0402, 0603, 0805, 1206, 1210, 1812, 1825, 2220 and 2225 case sizes
DC voltage ratings of 10V, 16V, 25V, 50V, 100V and 200V
Capacitance offerings ranging from 0.5pF up to 0.47μF
Available capacitance tolerances of ±0.25pF, ±0.5pF, ±1%, ±2%, ±5%, ±10% and ±20%
No piezoelectric noise
Extremely low ESR and ESL
High thermal stability
High ripple current capability
Preferred capacitance solution at line frequencies and into the MHz range
No capacitance change with respect to applied rated DC voltage
Negligible capacitance change with respect to temperature
No capacitance decay with time
Non-polar device, minimizing installation concerns
SnPb end metallization option available upon request (5% min)
Applications
Typical applications include military, space quality and high reliability electronics.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1026_COTS_C0G • 6/6/2011
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