I17120XYIR01
| Model | I17120XYIR01 |
| Description | Speech Synthesizer With RCDG, 240s, DIE |
| PDF file | Total 24 pages (File size: 351K) |
| Chip Manufacturer | WINBOND |
ISD1700 SERIES
Example #3: Connecting the SPI Interface to a microcontroller
24
23
25
26
19
22
REC
PLAY
ERASE
FWD
VOL
FT
3
Reset
0.1
μ
F
RESET
LED
2
V
CCD
1
V
SSD
28
V
CCA
21
V
SSA
8
1 KΩ
D1
vAlert
V
CCD
0.1
μ
F
*
V
CCA
0.1
μ
F
V
CCP
*
0.1
μ
F
*
**
V
CCA
V
CCD
V
CCP
Vcc
**
Gnd
7
6
To uC
SPI
5
4
SS
SCLK
MOSI
MISO
MIC+
MIC -
AnaIn
R
OSC
AGC
*
ISD1700
V
CCP
14
V
SSP1
16 0.1
μ
F
V
SSP2
12
SP+
SP-
AUD/AUX
15
13
17
10
11
0.1
μ
F
Rosc ***
9
20
18
4.7
μ
F
*** At 8kHz sampling freq, Rosc = 80 K
Speaker
or Buzzer
V
CC
Speaker
AUD
V
CCD
8050C
390
Ω
INT/RDY
27
100 K
Ω
Optional
AUX
0.1
μ
F
Optional: based upon the applications
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
10.1
G
OOD
A
UDIO
D
ESIGN
P
RACTICES
To ensure the highest quality of voice reproduction, it is important to follow good audio design
practices in layout and power supply decoupling. See recommendations from below links or other
Application Notes in our websites.
Design Considerations for ISD1700 Family
AN-CC1002 Design Considerations for ISD1700 Family.pdf
Good Audio Design Practices
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf
Single-Chip Board Layout Diagrams
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf
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