N16T1630C2BZ2
| Model | N16T1630C2BZ2 |
| Description | 16Mb Ultra-Low Power Asynchronous CMOS SRAM |
| PDF file | Total 9 pages (File size: 239K) |
| Chip Manufacturer | ETC |
NanoAmp Solutions, Inc.
Ball Grid Array Package
A1 BALL PAD
CORNER (3)
D
0.23±0.05
0.90±0.10
N16T1630C2B
1. 0.30±0.05 DIA.
E
2. SEATING PLANE - Z
0.15 Z
0.05
TOP VIEW
SIDE VIEW
1. DIMENSION IS MEASURED AT THE
A1 BALL PAD
MAXIMUM SOLDER BALL DIAMETER.
CORNER
PARALLEL TO PRIMARY Z.
2. PRIMARY DATUM Z AND SEATING
PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE
SOLDER BALLS.
3. A1 BALL PAD CORNER I.D. TO BE
MARKED BY INK.
K TYP
J TYP
e
Z
SD
e
SE
BOTTOM VIEW
Dimensions (mm)
e = 0.75
D
6±0.10
E
SD
8±0.10
0.375
SE
0.375
J
1.125
K
1.375
BALL
MATRIX
TYPE
FULL
(DOC#14-02-007 REV F ECN# 01-1103)
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
8
Related PDFs
| Model | Description | Manufacturer | Operation |
|---|---|---|---|
 N16T1630C2BZ2-55
|
16Mb Ultra-Low Power Asynchronous CMOS SRAM | ETC | Preview |
|
N16T1630C2BZ2-70
|
16Mb Ultra-Low Power Asynchronous CMOS SRAM | ETC | Preview |
