Q2004L31V
| Model | Q2004L31V |
| Description | Thyristor Product Catalog |
| PDF file | Total 224 pages (File size: 3M) |
| Chip Manufacturer | TECCOR |
Quality and Reliability
Reliability Stress Tests
The following table contains brief descriptions of the reliability tests commonly used in evaluating Teccor product reliability on a peri-
odic basis. These tests are applied across product lines depending on product availability and test equipment capacities. Other tests
may be performed when appropriate.
Test Type
High Temperature
AC Blocking
High Temperature
Storage Life
Temperature and Humidity
Bias Life
Typical Conditions
T
A
= 100 °C to 150 °C, Bias @
100%
Rated V
DRM
, t = 24 hrs to 1000 hrs
T
A
= 150 °C, t = 250 to 1000 hrs
T
A
= 85 °C to 95 °C, rh = 85% to
95%
Bias @ 80% Rated V
DRM
(320 VDC max)
t = 168 to 1008 hrs
T
A
= -65 °C to 150 °C,
cycles = 10 to 500
Test Description
Evaluation of the reliability of
product under bias conditions
and elevated temperature
Evaluation of the effects on
devices after long periods of
storage at high temperature
Standards
MIL-STD-750, M-1040
MIL-STD-750, M-1031
Evaluation of the reliability of non- EIA / JEDEC, JESD22-A101
hermetic packaged devices in
humid environments
Temperature Cycle
[Air to Air]
Evaluation of the device’s ability
to withstand the exposure to
extreme temperatures and the
forces of TCE during transitions
between temperatures
MIL-STD-750, M-1051,
EIA / JEDEC, JESD22-A104
Thermal Shock
[Liquid to Liquid]
Autoclave
Resistance to
Solder Heat
Solderability
T
A
= 0 °C to 100 °C, t
txfr
=
≤10
s,
cycled = 10 to 20
Evaluation of the device’s ability MIL-STD-750, M-1056
to withstand the sudden changes
in temperature and exposure to
extreme temperatures
T
A
= 121 °C, rh = 100%, P = 15 psig, Accelerated environmental test to EIA / JEDEC, JESD22-A102
evaluate the moisture resistance
t = 24 hrs to 168 hrs
of plastic packages
T
A
= 260 °C, t = 10 s
Evaluation of the device’s ability MIL-STD-750, M-2031
to withstand the temperatures as
seen in wave soldering
operations
Evaluation of the solderability of
device terminals after an
extended period
MIL-STD-750, M-2026,
ANSI-J-STD-002
Steam aging = 1 hr to 8 hrs,
T
solder
= 245 °C, Flux = R
Flammability Test
For the UL 94V0 flammability test, all expoxies used in Teccor encapsulated devices are recognized by Underwriters Laboratories
©2002 Teccor Electronics
Thyristor Product Catalog
P-9
http://www.teccor.com
+1 972-580-7777
