W185-5
| Model | W185-5 |
| Description | Six Output Peak Reducing EMI Solution |
| PDF file | Total 8 pages (File size: 119K) |
| Chip Manufacturer | CYPRESS |
W185
Package Diagram
24-Pin Shrink Small Outline Package (SSOP, 209-mil)
8
7
6
5
4
3
REV .
2
DE S CRIPTIO N
1
DA TE
OR IG INA TO R
00
1.00
D/2
1.00 DIA.
3
2
1
INITIAL RELEASE PER DCN#A33907.
REVISED PER DCN#D20214.
REVISED PER DCN#D20760.
REVISED PER DCN#D21151.
REVISED PER DCN#D22219.
REVISED PER DCN#P60056.
b1
WITH LEAD FINISH
E
2.36
DIA. PIN
01
02
03
04
H +
1.00
0.20
M E
M
E/2
05
HI
L
I
P
P
06/13
1991
11/05
1992
11/08
1993
04/26
1994
06/19
1995
03/19
1996
HJC
YMK
EBA
EBA
EBA
J.B.C.
E
E
IN
c
c1
D
N
6
TOP VIEW
12-16°
+
e
0.12
b 8
A
A
2
M T
E
D
S
BOTTOM VIEW
C
-C-
-T-
3
0.076
C
7
-E-
-D-
4
A
1
SEATING
PLANE
.235 MIN
SEE
DETAIL "A"
SIDE VIEW
B
0° MIN.
END VIEW
GAUGE PLANE
PARTING LINE
R
G
0.25 BSC
C
O
C
L
G
A
5
SEATING PLANE
L1
DETAIL 'A'
FINIS H
8
7
6
5
8
7
6
5
THIS TABLE IN MILLIMETERS
E
S
Y
M
B
O
L
COMMON
DIMENSIONS
NOM.
MIN.
MAX.
1.86
1.73
0.05
0.13
1.68
1.73
0.25
-
0.25
0.30
0.09
-
0.09
0.15
SEE VARIATIONS
5.20
5.30
0.65 BSC
7.65
7.80
0.63
0.75
1.25 REF.
SEE VARIATIONS
1.99
0.21
1.78
0.38
0.33
0.20
0.16
5.38
7.90
0.95
N
O
T
E
NOTE
VARI-
ATIONS
AA
AB
AC
AD
AE
AF
D
A
A
1
A
2
b
b1
c
c1
D
E
8,10
10
10
10
4
4
e
H
L
L1
N
O
C
5
6
R
C
0°
0.09
4°
0.15
8°
C
THIS TABLE IN INCHES
S
Y
M
B
O
L
COMMON
DIMENSIONS
NOM.
MIN.
MAX.
.068
.073
.002
.005
.066
.068
.010
-
.010
.012
.004
-
.004
.006
SEE VARIATIONS
.205
.209
.0256 BSC
.301
.307
.025
.030
.049 REF.
SEE VARIATIONS
.078
.008
.070
.015
.013
.008
.006
.212
.311
.037
N
O
T
E
NOTE
VARI-
ATIONS
AA
AB
AC
AD
AE
AF
B
A
A
1
A
2
b
b1
c
c1
D
E
8,10
10
10
10
4
4
e
H
L
L1
N
C
O
5
6
A
R
0°
.004
4°
.006
6
8°
SIZE
8
7
5
© Cypress Semiconductor Corporation, 2000. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
S-
P
4
D
8.
b
BASE METAL
NOTES:
1.
2.
3.
4.
SECTION G-G
10.
MAXIMUM DIE THICKNESS ALLOWABLE IS 0.43mm (.017 INCHES).
DIMENSIONING & TOLERANCES PER ANSI.Y14.5M-1982.
"T" IS A REFERENCE DATUM.
"D" & "E" ARE REFERENCE DATUMS AND DO NOT
INCLUDE MOLD FLASH OR PROTRUSIONS, BUT
DO INCLUDE MOLD MISMATCH AND ARE MEASURED
AT THE PARTING LINE, MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15mm PER SIDE.
DIMENSION IS THE LENGTH OF TERMINAL
FOR SOLDERING TO A SUBSTRATE.
TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN 0.08mm AT SEATING PLANE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13mm TOTAL IN
EXCESS OF b DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION b BY MORE
THAN 0.07mm AT LEAST MATERIAL CONDITION.
CONTROLLING DIMENSION: MILLIMETERS.
C
5.
6.
7.
8.
B
9.
10. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25mm FROM LEAD TIPS.
11. THIS PACKAGE OUTLINE DRAWING COMPLIES WITH
JEDEC SPECIFICATION NO. MO-150 FOR THE LEAD COUNTS SHOWN
DECIMAL
XX±
XXX±
XXXX±
MA TE RIAL
ANGULAR
±
P RO JEC TION
An a m In du stria l Co ., LT D. Am kor/A na m P ilip in as, INC.
Se o ul, K ore a
Ma nil a, Ph ili pp ine s
Am kor E le ctron ics
Am kor E le ctr on ics
Ir ving , TX
Cha nd le r, AZ
D ATE
6 /1 3
19 91
6 /1 3
19 91
6 /1 3
19 91
6 /1 3
19 91
S IZ E
D WG . N O.
TITL E
E X CE LL EN CE IN S EM IC ON DUCTO R
A S SE MB L Y A ND TE ST
A PP RO V AL S
DR AW N
M. CHAVEZ
CH ECK E D
PACKAGE OUTLINE,
5.30mm (.209") BODY, SSOP
RE V.
A
M. BANGLOY
E NG 'R
H. BAUTISTA
RE L EA S ED
A1
S CAL E
32289
SHE E T
05
1 of 2
1
DO NOT SCALE DRAWING
H.J. CHOI
4
3
2
4
3
2
1
MIN.
6.07
6.07
7.07
8.07
10.07
10.07
4
D
NOM.
6.20
6.20
7.20
8.20
10.20
10.20
6
N
MAX.
6.33
6.33
7.33
8.33
10.33
10.33
14
16
20
24
28
30
E
D
VARIATION AF
IS DESIGNED BUT NOT TOOLED
MIN.
.239
.239
.278
.318
.397
.397
4
D
NOM.
.244
.244
.284
.323
.402
.402
6
N
MAX.
.249
.249
.289
.328
.407
.407
14
16
20
24
28
30
B
TITLE
PACKAGE OUTLINE,
5.30mm (.209") BODY, SSOP
DWG. NO.
REV.
A
A1
SCALE
32289
8/1
2
SHEET
05
2 of 2
1
4
3
