B1160C
| Model | B1160C |
| Description | solid state crowbar devices |
| PDF file | Total 212 pages (File size: 2M) |
| Chip Manufacturer | TECCOR |
Package Dimensions
Modified DO-214AA
The Modified DO-214AA package is a three-leaded surface mount (SM) package.
TEMPERATURE
MEASUREMENT
POINT
B
D
M
N
PIN 3
P
A C
PIN 1
PIN 2
H
E
.079
(2.0)
.079
(2.0)
J
.079
(2.0)
.040
(1.0)
.110
(2.8)
.030
(.76)
F
L
K
G
PAD OUTLINE
(MM)
Note: A stripe is marked on some parts, to indicate the cathode. IPC-SM-782 recommends 2.4 instead of 2.0.
Inches
Dimension
A
B
C
D
E
F
G
H
J
K
L
M
N
P
MIN
0.140
0.205
0.077
0.166
0.036
0.073
0.004
0.077
0.043
0.008
0.039
0.022
0.027
0.052
MAX
0.155
0.220
0.083
0.180
0.056
0.083
0.008
0.086
0.053
0.012
0.049
0.028
0.033
0.058
MIN
3.56
5.21
1.96
4.22
0.91
1.85
0.10
1.95
1.09
0.20
0.99
0.56
0.69
1.32
Millimeters
MAX
3.94
5.59
2.11
4.57
1.42
2.11
0.20
2.18
1.35
0.30
1.24
0.71
0.84
1.47
Notes:
• Dimensions and tolerancing per ASME Y14.5M-1994
• Mold flash shall not exceed 0.13 mm per side.
• Dimensions B and C apply to plated leads.
• All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
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© 2002 Teccor Electronics
Data Book and Design Guide
